Grain growth in nanocrystalline NbAl3 prepared by mechanical alloying

Isonishi, Kazuo; Okazaki, Kenji

doi:10.1007/bf00353186

Cited by 30 publications

(10 citation statements)

References 3 publications

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“…Otherwise the activation energy for the grain growth is lower than that for the grain boundary self-diffusion in polycrystalline copper, which is about 1.1 eV [27]. A similar activation energy for the grain growth was reported for other nanocrystalline materials such as copper [4], NbAl 3 [6], and iron [18]. These materials were prepared by mechanical alloying or attrition.…”

Section: Resultsmentioning

confidence: 72%

“…Below 490°C, this dependence is violated as no grain growth occurs and the grain size is equal to the grain size after milling. The exponent n that describes the grain growth kinetics is typically equal to 2, 3, or 4 [4,6,15,16], or, in some cases, up to n = 20 [17,18]. Since the mechanism that controls grain growth is reflected in n, it is of interest to evaluate n and work backwards to determine the growth mechanism.…”

Section: Resultsmentioning

confidence: 99%

“…For example, in mechanically-alloyed RuAl powder, the grain size rises from 5 nm after milling up to 80 nm after annealing at 1000°C for 5 h [5]. The NbAl 3 alloy also shows high thermal stability of the nanocrystalline microstructure [6]. The initial grain size of 8 nm (after mechanical alloying) increases up to 70 nm during a heat treatment at 1000°C for 3 h. The microstructure in a mechanically alloyed MgCu alloy remains nanocrystalline with a grain size of ca.…”

Section: Introductionmentioning

confidence: 95%

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High thermal stability of mechanically-alloyed nanocrystalline Cu–Nb alloys

Botcharova

Freudenberger

Schultz

2006

International Journal of Materials Research

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The high thermal stability of a nanocrystalline mechanically-alloyed Cu -Nb alloy was studied by means of isothermal annealing at high temperatures. The structure of the Cu matrix remains nanocrystalline with a grain size of about 50 nm even after annealing at 1000°C for 10 h. The copper grain growth is described with the help of kinetic analyses. The activation energy of the copper grain growth in Cu-10 at.% Nb is about 0.98 eV and the grain growth exponent is 4. The enhanced stability of the nanocrystalline Cu microstructure is attributed to the diffusion of Nb atoms along the Cu grain boundaries, "Zener drag" of NbO, Cu 2 O or Fe 7 Nb 6 particles, and a non-equilibrium state of Cu grain boundaries.

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Section: Resultsmentioning

confidence: 72%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 95%

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High thermal stability of mechanically-alloyed nanocrystalline Cu–Nb alloys

Botcharova

Freudenberger

Schultz

2006

International Journal of Materials Research

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“…X-ray is often used to measure the grain size of nanostructured materials [34][35][36][37][38][39] because it is simple and readily available. The grain size measured by x-ray has been …”

Section: A Comparison Of X-ray Results With Tem Observationsmentioning

confidence: 99%

Nanostructures in Ti processed by severe plastic deformation

et al. 2003

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Metals and alloys processed by severe plastic deformation (SPD) can demonstrate superior mechanical properties, which are rendered by their unique defect structures. In this investigation, transmission electron microscopy and x-ray analysis were used to systematically study the defect structures, including grain and subgrain structures, dislocation cells, dislocation distributions, grain boundaries, and the hierarchy of these structural features, in nanostructured Ti produced by a two-step SPD procedure-warm equal channel angular pressing followed by cold rolling. The effects of these defect structures on the mechanical behaviors of nanostructured Ti are discussed.

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“…The increase in the grain growth activation energy with solute additives can be observedbycomparing the activationenergy in single phase Al 3 Nb withthat of the same phase alloyed with Ti. The grain growth activation energy of Al 3 Nb has been obtained to be 162 ±2kJmol -1 [18] while that of Al 3 Nb-5.5 wt.%Ti was 201 ±2kJ mol -1 [19]. The mobility of <111> tiltb oundaries witha ngle of misorientation between 37 and 43 o was investigated in bicrystals of differently pure Al by Molodove tal.…”

Section: Introductionmentioning

confidence: 99%