Grain growth and texture changes in a Ni foil during diffusion bonding to ZrO<sub>2</sub>

Mun, Je-Do; Derby, Brian

doi:10.1080/01418619708209975

Philosophical Magazine A

1997

DOI: 10.1080/01418619708209975

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Grain growth and texture changes in a Ni foil during diffusion bonding to ZrO₂

Je-Do Mun

Brian Derby

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“…80,81 have investigated the joining of ZrO 2 using nickel and copper interlayers bonded in the temperature regimes 1000-1200 and 700-900uC respectively, with a uniaxial pressure of 10 MPa. Strengths of 135-150 MPa with a Ni interlayer and 180-240 MPa with a Cu interlayer were exhibited at room temperature.…”

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confidence: 99%

Joining of engineering ceramics

Fernie

Drew

Knowles

2009

International Materials Reviews

244

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Engineering ceramics such as alumina, zirconia, silicon nitride and silicon carbide can now be manufactured reliably with reproducible properties. As such, they are of increasing interest to industry, particularly for use in demanding environments, where their thermomechanical performance is of critical importance, with applications ranging from fuel cells to cutting tools. One aspect common to virtually all applications of engineering ceramics is that eventually they must be joined with another material, most usually a metal. The joining of engineering ceramics to metals is not always easy. There are two main considerations. The first consideration is the basic difference in atomic bonding: the ionic or covalent bonding of the ceramic, compared to the metallic bond. The second consideration is the mismatch in the coefficient of thermal expansion. In general, ceramics have a lower coefficient of thermal expansion than metals and, if high tensile forces are produced in the ceramic, either as a consequence of operating conditions or from the joining procedure itself, failure can occur. The plethora of joining processes available will be reviewed in this article, placing them in context from both an academic and commercial perspective. Comment will be made on research reporting advances on known technology, as well as introducing 'newer' technologies developed over the last 10 years. Finally, reviews and commentary will be made on the potential applications of the various joining processes in the commercial environment.

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mentioning

confidence: 99%

Joining of engineering ceramics

Fernie

Drew

Knowles

2009

International Materials Reviews

244

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Diffusion bonding of the textured Ni tapes for the substrate of YBCO coated conductors

Goo

Kim

et al. 1998

Physica C: Superconductivity

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Effect of compression on grain growth in Al films

Volkert

Lingk²

1998

Applied Physics Letters

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The effect of compression on grain growth in Al and Al(Cu) films on oxidized Si substrates has been studied. Samples were compressed in a uniaxial press during annealing at 400 °C, and then examined using focused ion beam imaging. It was found that the compressed regions had a final grain size roughly a factor of 3 larger than in the uncompressed regions. This behavior is interpreted as due to a decrease in grain boundary grooving and the pinning forces associated with them, thus allowing enhanced grain growth.

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Grain growth and texture changes in a Ni foil during diffusion bonding to ZrO₂

Cited by 4 publications

References 15 publications

Joining of engineering ceramics

Joining of engineering ceramics

Diffusion bonding of the textured Ni tapes for the substrate of YBCO coated conductors

Effect of compression on grain growth in Al films

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About

Grain growth and texture changes in a Ni foil during diffusion bonding to ZrO2

Cited by 4 publications

References 15 publications

Joining of engineering ceramics

Joining of engineering ceramics

Diffusion bonding of the textured Ni tapes for the substrate of YBCO coated conductors

Effect of compression on grain growth in Al films

Contact Info

Product

Resources

About

Grain growth and texture changes in a Ni foil during diffusion bonding to ZrO₂