Grain Boundary Migration in Polycrystals

Rohrer, Gregory S.; Chesser, Ian; Krause, Amanda R.; Naghibzadeh, S. Kiana; Xu, Zipeng; Dayal, Kaushik; Holm, Elizabeth A.

doi:10.1146/annurev-matsci-080921-091511

Cited by 16 publications

(3 citation statements)

References 120 publications

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“…Under the influence of temperature, atoms can diffuse along the boundaries between particular crystallites, which leads to their coalescence. Moreover, annealing of polycrystalline films can lead to grain boundary migration to reduce the surface energy of the system [ 52 ]. Both of these mechanisms contribute to an increase in grain size with each successive repetition of the HT+RTA cycle.…”

Section: Resultsmentioning

confidence: 99%

Effect of repeating hydrothermal growth processes and rapid thermal annealing on CuO thin film properties

Ozga,

Zielony,

Wierzbicka

et al. 2024

Beilstein J. Nanotechnol.

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This paper presents an investigation into the influence of repeating cycles of hydrothermal growth processes and rapid thermal annealing (HT+RTA) on the properties of CuO thin films. An innovative hydrothermal method ensures homogeneous single-phase films initially. However, their electrical instability and susceptibility to cracking under the influence of temperature have posed a challenge to their utilization in electronic devices. To address this limitation, the HT+RTA procedure has been developed, which effectively eliminated the issue. Comprehensive surface analysis confirmed the procedure’s ability to yield continuous films in which the content of organic compounds responsible for the formation of cracks significantly decreases. Structural analysis underscored the achieved improvements in the crystalline quality of the films. The implementation of the HT+RTA procedure significantly enhances the potential of CuO films for electronic applications. Key findings from Kelvin probe force microscopy analysis demonstrate the possibility of modulating the work function of the material. In addition, scanning capacitance microscopy measurements provided information on the changes in the local carrier concentration with each repetition. These studies indicate the increased usefulness of CuO thin films obtained from the HT+RTA procedure, which expands the possibilities of their applications in electronic devices.

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Section: Resultsmentioning

confidence: 99%

Effect of repeating hydrothermal growth processes and rapid thermal annealing on CuO thin film properties

Ozga,

Zielony,

Wierzbicka

et al. 2024

Beilstein J. Nanotechnol.

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“…A lower degree of supersaturation decreases the nucleation rate of nickel grains, resulting in the formation of fewer new grains. Consequently, the existing nickel grains continue to grow, leading to an increase in grain size [19,20].…”

Section: Surface Morphology Of Mnn Materialsmentioning

confidence: 99%

Preparation of Fe3O4/NiO Nanomaterials by Electrodeposition and Their Adsorption Performance for Fluoride Ions

Zhang,

Li,

et al. 2024

Coatings

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The high concentration of fluoride ions in industrial wastewater poses a threat to both human safety and the ecological environment. In this paper, three types of magnetic NiO nanomaterial (MNN) with nickel–iron ratios of 3:1, 2:1, and 1:2 were successfully prepared using the electrodeposition technique to eliminate fluoride ions (F−) from industrial wastewater. The surface morphology, phase composition, and chemical structure of the nanomaterials were analyzed using scanning electron microscopy (SEM), transmission electron microscopy (TEM), and X-ray diffraction (XRD). The results demonstrate the MNN material’s exceptional adsorption capabilities for fluoride ions (F−) at a nickel–iron ratio of 3:1, with a maximum adsorption capacity of up to 58.3 mg/g. The adsorption process of fluoride on the MNN material was further examined using Langmuir and pseudo-second-order kinetic models, revealing predominantly monolayer adsorption and chemisorption characteristics. When the amount of FeSO4•9H2O added is minimal, only the distinctive peaks of NiO are visible in the product’s spectrum. However, as the Ni/Fe ratio decreases, characteristic peaks of Fe3O4 crystals begin to appear and gradually intensify, indicating an increase in Fe3O4 content within the MNN material. Additionally, the pH level significantly affects the adsorption of fluoride ions (F−) onto the MNN material, with the highest adsorption capacity observed at pH 7.

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“…Grain growth, fundamentally, can be viewed as a manifestation of grain boundary migration. This migration behavior, in turn, is largely governed by grain boundary properties and curvature [15,16] . Delving deeper into grain boundary properties, the five‐parameter characterization of a grain boundary becomes imperative for comprehensive understanding [17‐20] .…”

Section: Introductionmentioning

confidence: 99%

3D characterization of abnormal grain growth in nanocrystalline nickel

Zhu,

Huang,

Cai

et al. 2023

Materials Genome Engineering Advances

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Abnormal grain growth, a pervasive phenomenon witnessed during the annealing of nanocrystalline metals, precipitates a swift diminution of the distinctive properties inherent to such materials. Historically, conventional transmission electron microscopy has struggled to efficiently procure comprehensive five‐parameter crystallographic information from a substantial number of grain boundaries in nanocrystalline metals, thus inhibiting a deeper understanding of abnormal grain growth behavior within nanocrystalline materials. In this study, we utilize a high‐throughput characterization method—three‐dimensional orientation mapping in the TEM (3D‐OMiTEM) to characterize the crystallographic five‐parameter character of grain boundaries with an area of over 3.4 × 106 nm2 in an abnormally grown nanocrystalline nickel sample. When coupled with existing theoretical simulation results, it is discerned that the grain boundary population shows a relatively large scatter when it is correlated to the calculated grain boundary energy; the grain boundaries of abnormally grown grains exhibit lower grain boundary energy compared to those that have not undergone abnormal growth. Merging high‐throughput grain boundary information obtained from three‐dimensional orientation mapping data with grain boundary properties derived from high‐throughput theoretical calculations following the concept of materials genome engineering will undoubtedly facilitate further advancements in comprehending and discerning the interfacial behaviors of crystalline materials.

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Grain Boundary Migration in Polycrystals

Cited by 16 publications

References 120 publications

Effect of repeating hydrothermal growth processes and rapid thermal annealing on CuO thin film properties

Effect of repeating hydrothermal growth processes and rapid thermal annealing on CuO thin film properties

Preparation of Fe3O4/NiO Nanomaterials by Electrodeposition and Their Adsorption Performance for Fluoride Ions

3D characterization of abnormal grain growth in nanocrystalline nickel

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