2011
DOI: 10.1016/j.mee.2011.03.024
|View full text |Cite
|
Sign up to set email alerts
|

Grain boundary mediated leakage current in polycrystalline HfO2 films

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
78
2

Year Published

2012
2012
2023
2023

Publication Types

Select...
8
1
1

Relationship

0
10

Authors

Journals

citations
Cited by 115 publications
(80 citation statements)
references
References 20 publications
0
78
2
Order By: Relevance
“…3.17b). The latter is opposite to the trends reported elsewhere where a higher leakage current is seen in the GBs which was assigned to the thinner oxide and also to the higher density of defect generally present on GBs [47]. It is known that grain boundaries may possess different conductivity associated to the higher concentration of defects, vacancies and other contributor to tunneling and trap assisted leakages.…”
Section: Peak Force Tuna Case Studiescontrasting
confidence: 78%
“…3.17b). The latter is opposite to the trends reported elsewhere where a higher leakage current is seen in the GBs which was assigned to the thinner oxide and also to the higher density of defect generally present on GBs [47]. It is known that grain boundaries may possess different conductivity associated to the higher concentration of defects, vacancies and other contributor to tunneling and trap assisted leakages.…”
Section: Peak Force Tuna Case Studiescontrasting
confidence: 78%
“…[51][52][53][54] Even considering the effect of hole trapping which can reduce the activation energy to oxygen vacancy generation, these results suggest that diffusion of pre-existing oxygen vacancies is always much more facile than defect generation in bulk TiO 2 . However, activation energies near the electrode interface [70][71][72] or at grain boundaries 12,73,74 may be considerably lower. Of the defect generation processes considered, Ti Frenkel formation appears as the most favorable.…”
Section: Discussionmentioning
confidence: 99%
“…Grain boundaries (GBs) in polycrystalline high-j (HK) dielectrics contain high density of electrically active defects, which results in locally varying electrical properties. The GBs favors accumulation of traps, triggering formation of percolation path [1][2][3][4]. These GBs pose a major concern in the reliability of HK and IL in dielectric stacks in advanced CMOS technology.…”
Section: Introductionmentioning
confidence: 99%