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2010
DOI: 10.1007/s12572-011-0025-z
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Grain boundary engineering in alloy D9 through thermo-mechanical processing: influence of process variables and aspects of micro-mechanisms

Abstract: By employing low-strain one-step thermomechanical processing (OTMP) and iterative thermomechanical processing (ITMP) we developed grain boundary engineered microstructure in a Ti-modified austenitic stainless steel (alloy D9). In OTMP, small amount of strain (0, 5, 10 and 15%) was imparted on solution annealed sample and subsequently annealed at various temperatures (1173-1273 K) for different time periods (0.5, 1 and 2 h). A pre-strain of 10-15% followed by annealing at 1273 K for 0.5-2 h has been found to be… Show more

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Cited by 5 publications
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