Graded coatings for thermal, wear and corrosion barriers

Problem of FGM TBC coated cylinder

“…In many applications structures or parts of structures are exposed to so high temperature, see Schulz et al [16], high temperature gradients, and/or cyclic temperature changes that conventional metallic materials cannot resist such extremal conditions, see Odqvist [17]. One of methods to improve the resistance of metallic structures against extreme temperature conditions consists in covering the structure with a ceramic layer since ceramics are known for their high thermal resistance.…”

“…These residual stresses may be significant relative to thermo-mechanical stresses applied subsequently. As regards FG layer processing, plasma spray TBC leads to lamellar microstructures, whereas columnar-lamellar microstructures are produced when using electron beam physical vapor deposition, see Lee et al [20], Schulz et al [16].…”

“…1a. [15] (a), microstructure of chemically graded electron beam physical vapour deposition thermal barrier coating, after Schulz et al [16], and the multi-step smooth approximation function of Young's modulus, after Szubartowski and Ganczarski [15] (b).…”

Optimizing the performance of uncoated and multilayer coated cermet inserts for surface roughness of en-8 steel

“…AS a result, the tools can cut at higher speed with reduced power consumptions (Watmon et al 2010). The cemented carbide tools which is coated with TiC, TiN having lifetime ten time more than uncoated tools (Schulz et al 2003). For the cutting tools one of the crucial parameter is hard coating.…”

Analytical Couple-stress Solution for Size-dependent Large-amplitude Vibrations of FG Tapered-nanobeams

“…Meanwhile, FGM concepts have triggered world-wide research activities which are applied to metals, ceramics and organic composites to produce modified components with superior physical and mechanical properties (Schulz et al, 2003). In recent years, the application of FGMs has broadly been spread in micro and nano structures such as thin films in the form of shape memory alloys (Fu et al, 2003(Fu et al, , 2004 and also in MEMS and NEMS (Witvrouw and Mehta, 2005;Lee et al, 2006).…”