52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
DOI: 10.1109/ectc.2002.1008085
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Gold-tin solder electroplating of photo-resist laminated AlN ceramics

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“…Electrodeposition in a stirred solution has the advantage of improved deposition rate and the deposits obtained are relatively free from porosity or pits, as the gas bubbles evolved in electrochemical reactions at the electrode surface are swept away. 8 Very little work has been reported till date on the effect of solution stirring on deposition behaviour of aluminium and other metals from ionic liquids. Pradhan and Reddy 9 reported an increased rate of deposition of dendrite free electrorefined aluminium using a stirred AlCl 3 -EMIC ionic liquid.…”
Section: Introductionmentioning
confidence: 99%
“…Electrodeposition in a stirred solution has the advantage of improved deposition rate and the deposits obtained are relatively free from porosity or pits, as the gas bubbles evolved in electrochemical reactions at the electrode surface are swept away. 8 Very little work has been reported till date on the effect of solution stirring on deposition behaviour of aluminium and other metals from ionic liquids. Pradhan and Reddy 9 reported an increased rate of deposition of dendrite free electrorefined aluminium using a stirred AlCl 3 -EMIC ionic liquid.…”
Section: Introductionmentioning
confidence: 99%