2018
DOI: 10.1016/j.vacuum.2018.08.033
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Gold, copper and gold/copper bimetallic nanoparticles obtained by focused ion beam sputter deposition and rapid thermal annealing

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Cited by 11 publications
(2 citation statements)
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“…The Ag3d 5/2 lines were tted with two components of binding energies 367.8 (silver in Ag x O) and 368.3 eV (metallic silver) [21]. The Cu2p 3/2 lines were tted with four components of binding energies 932.5, 932.7, 933.7, and 934.8 eV, which were corresponding to the copper atoms in Cu 2 O, Cu, CuO, and Cu-OH or Cu(OH) 2 [22], respectively.…”
Section: Xpsmentioning
confidence: 99%
“…The Ag3d 5/2 lines were tted with two components of binding energies 367.8 (silver in Ag x O) and 368.3 eV (metallic silver) [21]. The Cu2p 3/2 lines were tted with four components of binding energies 932.5, 932.7, 933.7, and 934.8 eV, which were corresponding to the copper atoms in Cu 2 O, Cu, CuO, and Cu-OH or Cu(OH) 2 [22], respectively.…”
Section: Xpsmentioning
confidence: 99%
“…It was reported that CuNPs surrounded by dielectric were fabricated by implanting Cu + ions into phosphate glass, polymers and Al 2 O 3 et al and followed by annealing, but the LSPR stabilities of CuNPs were not discussed [9,10]. CuNPs can also be deposited via vacuum coating, where Cu atoms were vaporized in a vacuum chamber, deposited on substrates, and finally agglomerated into CuNPs [11,12]. During deposition, no solution was applied, therefore clean CuNPs could be obtained, and the oxidation of CuNPs was weak [13].…”
Section: Introductionmentioning
confidence: 99%