Gold contacts to semiconductor devices

Abstract

The electronics revolution led by computers and microprocessors is based on the silicon integrated circuit. Gold contactsplayakey role in the fabrication of integratedcircuits. For microwave devices and integrated circuits made from compoundsemiconductors such as gallium arsenide, gold metallization is used for both ohmic and rectifying contacts.The world-wide explosion in information-processing and in automation for industry is a direct result of the widespread availability of the integrated circuits contained on small 'chips' of silicon and other semiconductors. In this highly competitive arena, gold plays a key role. Gold as a material for making contacts to semiconductors has made a greater contribution than any other metal to advances in integrated circuit development. The present computer and micro-processor based technology that tests on the availability of low-cost and reliable electronic components can trace its present high-performance capabilities to the utilization of gold contacts.Other articles in GoldBulletin have been concerned with the application of gold in solar cells (1) and in thyristors (2). In this review, we consider gold as the contact, the medium through which electrical signals generated within semiconductor devices are transmitted to the outsideworld. As we wilt see, gold serves in many cápacities frc m that of a'weld' material formed in low temperature processing to that of the rectifying contact in the most-advanced, high-speed devices used in microwave and high-frequency devices. In the field of physics research, the application of gold in semiconductor devices has been the key element in detectors of nuclear radiation which have dominated low-energy nuclear physics for nearly two decades.In electronic systems the prime objective is to minimize voltage losses in the current carrying connections. It is also imperative that the electrical properties of the connectors do not change when exposed to air. In these respects, gold is by far the outstanding candidate and is the immediate choice in metallization schemes. Even a cursory examination of a commercial microprocessor will reveal that the external contacts on the package are gold-plated to ensure against degradation in the operating environment (Figure 1).

Highly Suppressed Dark Current and Fast Photoresponse from Au Nanoparticle-Embedded, Si/Au/WS2 Quantum-Dot-Based, Self-Biased Schottky Photodetectors

“…At the Au/WS 2 interface, a Schottky junction is formed between the WS 2 QDs and the Au NPs. On the other hand, at the p-Si/Au interface, an Ohmic-type contact is formed, which does not partake in any rectification. , In the present case, during the RTA process, Au atoms from the Au layer diffuse into the Si layer and form a disordered Au–Si alloy with low resistivity, as reported in the literature . Further, when the Au electrode is deposited on the Au NPs, the contact with the Si layer becomes uniform, and this ensures low contact resistance, resulting in reasonably good Ohmic contact with the Si layer and it helps in efficient charge extraction.…”

Critical behavior of the insulator-to-metal transition in Te-hyperdoped Si

“…Samples were measured in the temperature range from 2 to 300 K and a magnetic field perpendicular to the sample plane swept from -5 T to 5 T. Prior to the electrical measurements, the native SiO2 layer was removed by HF etching. Subsequently, gold electrodes were sputtered onto the four corners of the squarelike samples to ensure Ohmic contact [30]. Silver glue was used to contact the wires to the gold electrodes.…”

The science and technology of gold

“…• Microelectronics, and especially in the production of connectors and contacts to semiconductors [73], • Photographic flash devices, • Photographic films [74,75] • Phosphors [76] for use, for example, on TV screens, • The glazing of buildings [77], • The form of radioisotopes in medicine [9,78], • Solar energy devices [79], • Special soldering and brazing alloys [9], • Catalysts [80] and, A large number of high technology instruments for monitoring and controlling temperature, pressure, humidity etc. [9].…”