Gold Coated Silver Bonding Wire and Its Consistent Reliability Performances

Abstract

Thermal aging of gold coated silver bonded ball with aluminium bond pads exhibited a stable interface without Kirkendall voids until 4000h at 200°C for an un-molded device tested under vacuum. Ball and stitch pull remains in strength and remained constant until 4000 hours of aging. The growth of aluminides at the bond interface is about 4.5µm for 4000 hours of aging. The electrical resistance of the bonded ball remains the same until 4000 hours at 175°C for an epoxy molded device, molded with 5 to 7 pH green epoxy molding compound containing low chlorine and sulfur. Interestingly, the bonded ball interface of epoxy molded device has sustained 480h on biased Highly Accelerated Stress Test (bHAST) at +20V bias, 130°C, 85%RH. The bonded ball interface is stable until 1000 hours on unbiased HAST (uHAST) at 130°C, 85% RH as well. Cross-sectional ovservations of the bonded balls revealed the presence of intermetallic phases at the bond interface. However, formation of Kirkendall voids or crack propagatioon due to galvanic corrosions are absent.