Failure Analysis and Prevention 2021
DOI: 10.31399/asm.hb.v11.a0006798
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Glossary of Terms—Failure Analysis and Prevention

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Cited by 7 publications
(13 citation statements)
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“…[ 48,49 ] Therefore, the existence of the big 9 R CRP at the grain boundary might be one reason for poor ductility as the CRP in 9 R acts as the high‐stress concentrating location (stress reservoir), which triggers an early intergranular fracture or brittle fracture at the grain boundaries. [ 50 ] The change of the CRP structure from BCC to 9 R, which occurs concurrently with the loss of the coherency between the CRP and its surrounding BCC‐ferritic matrix, contributes to the limited ductility represented by 17% TE. [ 51 ]…”
Section: Discussionmentioning
confidence: 99%
“…[ 48,49 ] Therefore, the existence of the big 9 R CRP at the grain boundary might be one reason for poor ductility as the CRP in 9 R acts as the high‐stress concentrating location (stress reservoir), which triggers an early intergranular fracture or brittle fracture at the grain boundaries. [ 50 ] The change of the CRP structure from BCC to 9 R, which occurs concurrently with the loss of the coherency between the CRP and its surrounding BCC‐ferritic matrix, contributes to the limited ductility represented by 17% TE. [ 51 ]…”
Section: Discussionmentioning
confidence: 99%
“…Impurity segregation at the PAGBs is the most common explanation for this kind of failure, and no link between Si content and impurity segregation has been found in the literature. [26] Therefore, the increase in yield stress due to higher Si levels is the most likely explanation for the increase in DBT temperature observed. Both increased solid-solution strengthening and decreased tempering of the matrix are thought to contribute, though the influence of each cannot be decoupled from the testing conducted.…”
Section: Dbt Temperaturementioning
confidence: 94%
“…As shown in Figure 6, increasing the yield stress of the steel can shift the DBT temperature upward, as can decreasing the brittle fracture stress. [22][23][24][25][26] Therefore, the increase in DBT temperature with increasing Si must be associated with the influence of Si on either the brittle fracture stress or yield stress. The DBT temperature can shift to higher temperatures by increasing a) the yield stress or decreasing the b) fracture stress.…”
Section: Dbt Temperaturementioning
confidence: 99%
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“…Shearography or speckle pattern shearing interferometry is an NDT technique that uses coherent light or coherent sound waves for the quality assessment of materials in different problems, such as nondestructive testing, strain measurement, and vibration analysis. It has a wide range of applications in the aerospace and wind turbine industries, among other areas [ 5 , 29 , 90 , 91 ]. The shearography techniques present several advantages over traditional NDT techniques, including (1) being capable of testing large area on the structure (up to 1 m 2 per minute [ 92 ]), (2) providing contactless techniques, (3) being relatively insensitive to environmental variations effects, and (4) performing well on honeycomb materials [ 93 ].…”
Section: Shm Of Composite Structuresmentioning
confidence: 99%