Global-to-Local Modeling and Experiment Investigation of HFCBGA Package Board-Level Solder Joint Reliability

Abstract

Due to the high speed and high I/O count requirements for semiconductor packages, thousands of soldered interconnections are indispensable, and this situation renders traditional finite element method (FEM) analysis a formidable challenge. This paper presents a 3D-equivalent global model and local submodeling technique to investigate board-level solder joint reliability under cyclic temperature loading. The equivalent global model is capable of addressing critical solder failure locations. An individual local solder ball is used to predict the number of cycles to failure. The high performance flip-chip ball grid array (HFCBGA) package case was studied with the provided experimental data. According to FEM results, the predicted solder ball life is close to that observed experimentally. Therefore, the global-to-local modeling technique can be concluded to provide an efficient methodology for evaluating very high pin count HFCBGA package reliability.

The Reliability of Solder Joints in Fine Pitch 3-D Stack Package by Taguchi Method

“…Fig 4 illustrates some detailed components and simplifications in the FEM of the stack TSV package. The micro-bumps were considered an equivalent layer with underfill because a small portion of SAC in micro-bump and its equivalent material properties can be addressed by [12]. There are many approaches used by researcher in the modeling of fatigue, such as stressed-based, plastic-based, plastic/creep strain-based, energy-based, and damage accumulated-based.…”