Global modeling of microwave applications by combining the FDTD method and a general semiconductor device and circuit simulator

Witzig, Andreas; Schuster, Christian; Regli, P.; Fichtner, W.

doi:10.1109/22.769327

Cited by 49 publications

(15 citation statements)

References 20 publications

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“…In order to analyze the signal propagation characteristics of such integrated systems, it is necessary to take account of various kinds of electromagnetic coupling between transmission lines, transmission lines and the ground plane, and lines and vias, as well as electromagnetic coupling including the nonlinear characteristics of active devices. For such requirements, it is now possible to obtain nonlinear transfer functions by unified analysis of the electromagnetic fields and the semiconductor active devices with three-dimen-sional device-field co-simulators such as ISE-TCAD [2]. However, since three-dimensional space discretization is involved, enormous computational resources and analysis time are needed.…”

Section: Introductionmentioning

confidence: 99%

An expression of high‐frequency characteristics on a high‐density multilayer wiring board using an LC ladder network as a unit segment

Ishikawa

Imai

Honjo

2007

Electron Comm Jpn Pt II

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SUMMARYThis paper presents a method of expressing a highspeed signal transmission line connecting the LSIs in a high-density multilayer wiring board in terms of cascaded connections of LC ladder networks. For signal transmission with a fundamental frequency beyond 1 GHz, the signal transmission lines in a multilayer board are treated as distributed transmission lines. However, there exist many scattering elements such as vias for interlayer connection in the multilayer board that disturb the transmission characteristic. Transmission characteristics affected by these elements are analyzed by electromagnetic field simulation in general. However, the simulation requires a lot of simulation time and computer resources. In order to simplify the simulation, the signal line structures in the board are constructed with combinations of several segments. Moreover, each unit segment is expressed in terms of an LC ladder network so that an analysis based on the lumped elements can be carried out within a short time. This paper describes a technique for deriving the L and C values of the ladder equivalent circuits for various unit segments such as passive components and transmission lines. By comparison with the electromagnetic field analysis and measurement, the usefulness of the method is demonstrated.

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Section: Introductionmentioning

confidence: 99%

An expression of high‐frequency characteristics on a high‐density multilayer wiring board using an LC ladder network as a unit segment

Ishikawa

Imai

Honjo

2007

Electron Comm Jpn Pt II

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“…Initially, the finite difference time domain (FDTD) method is adopted to couple with the lumped circuits because of its simplicity in theory and implementation. The lumped components are distributed into the FDTD grid [1], [2] or equivalent sources are introduced at specific FDTD edges [3]- [6]. Compared with the FDTD method, the finite-element time-domain (FETD) method is more flexible in terms of geometry modeling and provides better accuracy.…”

Section: Introductionmentioning

confidence: 99%

Embedding the Behavior Macromodel Into TDIE for Transient Field-Circuit Simulations

Zhang

Jiang

Yao

2016

IEEE Trans. Antennas Propagat.

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A novel transient field-circuit simulation method based on the time-domain integral equation (TDIE) and circuit macromodels is proposed. The traditional field-circuit simulation process constructs the Kirchoff's equations for linear or nonlinear lumped circuits, which cannot handle problems with unknown circuit structure. The proposed method creates parametric behavior macromodels to represent the port constitutive relations of the circuits. Artificial neural network technique is adopted to estimate the model parameters based on the known port voltages and currents. Then the obtained macromodel is coupled with TDIE that describes the behavior of electromagnetic subsystem to form equations of a whole system, which can be solved to obtain the fields, voltages and currents. Numerical examples are presented to demonstrate the validity of the proposed method.

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“…In most of the existing field-circuit simulation methods [1]- [3], the full-wave method is adopted to analyze the electromagnetic structure by solving Maxwell's equations, and the SPICE-type circuit model is utilized to construct the circuit equations. Then the electromagnetic and circuit equations are coupled together to accurately describe the interaction between electromagnetic structures and circuit elements.…”

Section: Introductionmentioning

confidence: 99%

Novel time domain integral equation method hybridized with the macromodels of circuits

Zhang

Yao

Jiang

2015

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

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This work presents a novel transient field-circuit simulation method based on the time-domain integral equation (TDIE) and circuit macromodels. The traditional field-circuit simulation method constructs the Kirchoff's equations for lumped circuits with SPICE models, but they cannot handle problems with unknown circuit structures. The proposed method creates parametric macromodels to represent the port constitutive relations of the unknown circuits. Then the obtained macromodel is coupled with TDIE to enable the transient field-circuit cosimulation. Numerical examples are given to demonstrate the validity of the proposed method. The proposed method is targeted to solve unknown I/O modeling issues in general signal integrity problems.

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Global modeling of microwave applications by combining the FDTD method and a general semiconductor device and circuit simulator

Cited by 49 publications

References 20 publications

An expression of high‐frequency characteristics on a high‐density multilayer wiring board using an LC ladder network as a unit segment

An expression of high‐frequency characteristics on a high‐density multilayer wiring board using an LC ladder network as a unit segment

Embedding the Behavior Macromodel Into TDIE for Transient Field-Circuit Simulations

Novel time domain integral equation method hybridized with the macromodels of circuits

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