Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array

Abstract

A unique electromagnetic-electro-thermal global simulation tool based on a universal error concept is presented. The advantages of this electro-thermal model are illustrated by comparison with a commercial electro-thermal circuit simulator. The first description of a fully physical, electro-thermal, microwave circuit simulation, based on coupling of the Leeds Physical Model of MESFETs and HEMTs, to a microwave circuit simulator, fREEDA T M (NCSU), is presented. The modeling effort is supported by parallel developments in electrooptic and thermal measurement. The first fully coupled EM-electro-thermal global simulation of a large microwave subsystem, here a whole spatial power combining MMIC array, is described. The simulation is partially validated by measurements of MMIC array temperature rise, and temperature dependent S-parameters. Electrothermal issues for spatial power combiner operation and modeling are discussed. The CAD tools and experimental characterization described, provide a unique capability for the design of quasi-optical systems and for the exploration of the fundamental physics of spatial power combining devices.

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels

“…Here the direct method is used; however, an electrical analogue of the thermal system is not required. The proposed simulation methodology is implemented in the multi-physics simulator fREEDA TM [17], which has the capability of simultaneously solving native electrical and thermal networks [18]. In the conventional direct approach there is the potential problem of mixing of electrical and thermal currents.…”