Glass-formation and hardness of Cu–Y alloys

Satta, Marta; Rizzi, Paola; Baricco, Marcello

doi:10.1016/j.jallcom.2008.07.148

Cited by 12 publications

(7 citation statements)

References 9 publications

(12 reference statements)

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“…These results are similar to those obtained for Cu-Y alloys, except for Cu 33 Y 67 [58]. Liquid Cu-Y system alloys also have a negative mixing enthalpy of -22 kJ/mol (for equiatomic binary alloy) which is close to that of liquid alloy in Cu-Zr system but the GFA of the eutectic Cu-Y alloys is much lower.…”

Section: Discussionsupporting

confidence: 84%

Role of different factors in the glass-forming ability of binary alloys

et al. 2014

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International audienceIn the present work, we discuss the glass-forming ability of various binary alloys in which the glassy phase was not formed even by melt spinning technique with high cooling rate of the melt up to 1 MK/s (some consisted of partly glassy phase), though by commonly accepted guidelines, these alloys could be as good glass-formers as many other binary glasses. The alloys studied belong to binary systems with multiple eutectics; the constituent elements have a negative enthalpy of mixing, and a significant variability of atomic size differences is observed from system to system. The results indicate the necessity of taking into account simultaneously various factors influencing the glass-forming ability including melt fragility

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Section: Discussionsupporting

confidence: 84%

Role of different factors in the glass-forming ability of binary alloys

et al. 2014

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“…As the compositions predicted with high GFA are mainly located in the Al-rich corner, i.e., AlxCuyY100−x−y (x = 60-100, y = 0-40), the experimental identified glass formation compositions in the Al-rich corner [20,21,[32][33][34][35] are then marked by the red dots in Figure 2, as they are presented in Figure 1. One can see from Figure 2 that experimental identified glass formation compositions in the Al-rich corner are densely clustered around the pinpointed stoichiometry of Al72Cu10Y18, suggesting that the stability of metallic glasses with ternary compositions around Al72Cu10Y18 are indeed enhanced.…”

Section: Resultsmentioning

confidence: 95%

Predicting Composition Dependence of Glass Forming Ability in Ternary Al-Cu-Y System by Thermodynamic Calculation

Wang

Liu

et al. 2014

Metals

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Abstract:The composition dependence of glass forming ability in the ternary Al-Cu-Y system is predicted by thermodynamic calculations based on the Miedema's model and Alonso's method. By comparing the relative energetic status of the amorphous phase versus the solid solution phase, a hexagonal composition region that energetically favoring the metallic glass formation is predicted. The glass formation driving force and crystallization resistance are further calculated and the composition of Al72Cu10Y18 is pinpointed with the largest glass forming ability in the Al-Cu-Y system. The calculation results are well supported by the experimental observations reported in the literature.

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“…1); the Y-Cu IMCs are known to show significantly higher fracture toughness of up to 12 MPa m 1/2 and lower hardness of down to 2.4 GPa. 18,19 This study constitutes the first-ever investigation of the positive effect of Y on the Pbfree SAC solder joint IMCs and requires further analysis for a thorough understanding of the mechanism associated with the effect of Y on the fracture strength and ductility of the SAC105 solder joint.…”

Section: Resultsmentioning

confidence: 99%

Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

Choi

Kaplan

Choe

2016

Journal of Elec Materi

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This is a preliminary investigation on the mechanical properties of Pb-free Sn-1.0Ag-0.5Cu solder joints containing 0.02 wt.% to 0.1 wt.% Y under a range of thermal aging and reflow conditions. Despite the significantly thicker intermetallic compound (IMC) formed at the solder joint, the 0.1 wt.% Y-doped joint exhibited a higher fracture strength than its baseline Sn-1.0Ag-0.5Cu counterpart under most aging and reflow conditions. This may be associated with the formation of Y-Cu IMCs formed at the interface between the solder and the Cu substrate, because the Y-Cu IMCs have recently been referred to as relatively 'ductile' IMCs.

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Glass-formation and hardness of Cu–Y alloys

Cited by 12 publications

References 9 publications

Role of different factors in the glass-forming ability of binary alloys

Role of different factors in the glass-forming ability of binary alloys

Predicting Composition Dependence of Glass Forming Ability in Ternary Al-Cu-Y System by Thermodynamic Calculation

Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

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