2007
DOI: 10.1109/jmems.2007.892887
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Glass Blowing on a Wafer Level

Abstract: Abstract-A fabrication process for the simultaneous shaping of arrays of glass shells on a wafer level is introduced in this paper. The process is based on etching cavities in silicon, followed by anodic bonding of a thin glass wafer to the etched silicon wafer. The bonded wafers are then heated inside a furnace at a temperature above the softening point of the glass, and due to the expansion of the trapped gas in the silicon cavities the glass is blown into threedimensional spherical shells. An analytical mod… Show more

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Cited by 103 publications
(59 citation statements)
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“…Bubbles along microcapillaries 7,8,16,17 and on-chip 18 devices can possess excellent optical transmission 7,8,16,17 together with low mechanical dissipation while allowing liquid to be placed inside the device. Additionally, such glass bubbles can benefit from optically excited vibrations as no electrodes are needed.…”
Section: Introductionmentioning
confidence: 99%
“…Bubbles along microcapillaries 7,8,16,17 and on-chip 18 devices can possess excellent optical transmission 7,8,16,17 together with low mechanical dissipation while allowing liquid to be placed inside the device. Additionally, such glass bubbles can benefit from optically excited vibrations as no electrodes are needed.…”
Section: Introductionmentioning
confidence: 99%
“…This enables larger near spherical microbubbles where the equatorial plane is located above the silicon substrate plane (critical for WGM light confinement with minimal coupling loss to the substrate) without using a complex silicon wafer bonding process, to increase the gas cavity volume, as was demonstrated by others 15 . Finally, Devcon 5 minute epoxy is used to carefully attach a N48 grade 1.5 mm diameter and 1.5 mm long neodymium magnet to the top of the microbubble, perpendicular to the sample plane, as seen in Fig.…”
Section: Fabrication and Testingmentioning
confidence: 94%
“…The chip-scale glassblowing process was first pioneered by Eklund and Shkel 15 for mechanical resonance applications. The process was modified and adapted for optical resonance as published in our earlier work, 14 which provides more detail on the fabrication process and WGM resonance achievable using these chip-scale microbubbles.…”
Section: Fabrication and Testingmentioning
confidence: 99%
“…Several techniques of glass micromachining currently exist, including drilling [13], milling [13], laser [13], sandblasting [13], wet etching [14,15], dry etching [16,17,18], glass molding techniques [6,19,20,21,22], etc . The first three methods are usually used for quite large pattern sizes and face problems with small structures.…”
Section: Introductionmentioning
confidence: 99%
“…In essence, the glass blowing can be thought of as the reverse of the glass reflow. Glass blowing has been described in previous publications [19]. First, an etched cavities in silicon is bonded with thin glass wafer.…”
Section: Introductionmentioning
confidence: 99%