Giga-hertz electrical characteristics of flip-chip BGA package exceeding 2,000 pin counts

Nakagawa, K.; Watanabe, Masaki; Baba, Shinji; Yamagishi, Kazumasa; Sasaki, Y.; Kamiyama, Tsuneo; Kimura, Michitaka

doi:10.1109/ectc.2004.1319361

Cited by 10 publications

(3 citation statements)

References 2 publications

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“…Those trends in combination with increasingly higher transfer data rates place the challenges on interconnect design at all levels [1][2][3]. High-speed memory subsystem, fullbuffered DIMM, is a good example, where multi-gigabit/s point-to-point serial differential interconnect is implemented among the advanced memory buffers and the host memory controller, which is being prominence for chip-to-chip communication.…”

Section: Introductionmentioning

confidence: 99%

High-speed differential interconnection design for flip-chip BGA packages

Yuan¹,

Kuah²,

Wang³

et al. 2006

2006 8th Electronics Packaging Technology Conference

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With the advancement of semiconductor technologies, packaging interconnect becomes one of the bottlenecks in high-performance devices. The paper deals with high-speed differential interconnect commonly used in the flip-chip ball grid array (Fc-BGA) packages. Layout issues for differential interconnect are first discussed, and the emphasis is put on the investigation on the effects of the discontinuity consisting of via and solder ball on electrical performance. Overall electrical performance of one typical differential pair is characterized and -15dB return loss and -23dB isolation between neighboring pairs are achieved up to 10 GHz. The purposes of this paper are to design and optimize high-speed series differential interconnects used in Fc-BGA packages with the first-round success.

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Section: Introductionmentioning

confidence: 99%

High-speed differential interconnection design for flip-chip BGA packages

Yuan¹,

Kuah²,

Wang³

et al. 2006

2006 8th Electronics Packaging Technology Conference

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show abstract

“…We believe that one of the important factors for the BGA performance is dielectric materials, which include ceramics [1] and organic materials. [2][3][4] We have been continuously developing buildup BGA substrates making use of organic materials [5] that are more advantageous over ceramics because of their low cost and microfabrication compatibility.…”

Section: Introductionmentioning

confidence: 99%

Low Warpage Coreless Substrate for IC Packages

Kurashina

Mizutani

Koide

et al. 2012

Transactions of The Japan Institute of Electronics Packaging

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“…This signal is encoded in the voltage difference between both wires. Differential pairs are essential for many electronic devices, because differential signaling has superior electrical characteristics to single ended signaling [1] [2]. In particular, differential signaling leads to lower cross-talk and lower electromagnetic interference.…”

Section: Differential Pairsmentioning

confidence: 99%

Universal Methodology to Handle Differential Pairs during Pin Assignment

Meister¹,

Lienig²,

Thomke³

2010

IFIP Advances in Information and Communication Technology

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Abstract. Differential signaling has been a major challenge in design automation. The routing of differential pairs requires a suitable pin assignment of the respective nets. However, current automatic pin assignment algorithms lack the ability to consider differential pairs. We present a methodology to include differential pairs during pin assignment. Our solution can be applied to automatic or manual pin assignment processes without changing the methodologies already in place. This universality is achieved by using any established pin assignment approach as a black box, which is extended by pre and post processing steps. Extensive studies in industrial design flows show that our differential pair methodology does not compromise pin assignment quality with the added benefit of effective differential pair allocations.

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Giga-hertz electrical characteristics of flip-chip BGA package exceeding 2,000 pin counts

Cited by 10 publications

References 2 publications

High-speed differential interconnection design for flip-chip BGA packages

High-speed differential interconnection design for flip-chip BGA packages

Low Warpage Coreless Substrate for IC Packages

Universal Methodology to Handle Differential Pairs during Pin Assignment

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