Single
crystal wafers, such as silicon, are the fundamental carriers
of advanced electronic devices. However, these wafers exhibit rigidity
without mechanical flexibility, limiting their applications in flexible
electronics. Here, we propose a new approach to fabricate 1.5 in.
flexible functional zinc oxide (ZnO) single crystal wafers with high
electron mobility (>100 cm2 V–1 s–1) and optical transparency (>80%) by a combination
of thin-film deposition, a chemical solution method, and surficial
treatment. The uniformity of the flexible single crystal wafers is
examined by an advanced scanning X-ray diffraction technique and photoluminescence
spectroscopy. The transport properties of ZnO flexible single crystal
wafers retain their pristine states under various bending conditions,
including cyclability and endurability. This approach demonstrates
a breakthrough in the fabrication of the flexible single crystal wafers
for future flexible optoelectronic applications.