2013
DOI: 10.1364/prj.1.000069
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Germanium tin: silicon photonics toward the mid-infrared [Invited]

Abstract: Germanium tin (GeSn) is a group IV semiconductor with a direct band-to-band transition below 0.8 eV. Nonequilibrium GeSn alloys up to 20% Sn content were realized with low temperature (160°C) molecular beam epitaxy. Photodetectors and light emitting diodes (LEDs) were realized from in situ doped pin junctions in GeSn on Ge virtual substrates. The detection wavelength for infrared radiation was extended to 2 μm with clear potential for further extension into the mid-infrared. GeSn LEDs with Sn content of up to … Show more

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Cited by 126 publications
(71 citation statements)
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“…Another recent photonic material development has been germanium tin (GeSn), a group IV binary compound semiconductor alloy with direct band-gap below 0.8 eV at certain compositions. No GeSn laser has been demonstrated yet, but electroluminescence devices spanning ∼1530-1900 nm wavelengths have been reported [53].…”
Section: Iii-v Lasers On Siliconmentioning
confidence: 99%
“…Another recent photonic material development has been germanium tin (GeSn), a group IV binary compound semiconductor alloy with direct band-gap below 0.8 eV at certain compositions. No GeSn laser has been demonstrated yet, but electroluminescence devices spanning ∼1530-1900 nm wavelengths have been reported [53].…”
Section: Iii-v Lasers On Siliconmentioning
confidence: 99%
“…1 Multi quantum well structures and superlattices based on tensile strained Ge/GeSn virtual substrates have been proposed as active materials for infrared light emitting devices integrated in a silicon-based photonic platform. [2][3][4] In these systems, owing to the a-Sn vs Ge lattice mismatch ($14%), the GeSn relaxed buffer layer induces in Ge a biaxial tensile strain parallel to the sample surface e par , which profoundly modifies its band structure, transforming it in a quasi-direct band gap semiconductor for e par > 1.6%.…”
Section: Introductionmentioning
confidence: 99%
“…9,10 All the discussed in situ process steps involve temperatures at which Ge/GeSn structures are unstable. 1 In fact, the semiconducting diamond lattice a-GeSn phase, needed for the epitaxial growth of GeSn alloy, is stable only at temperatures below 13.2 C. Moreover, Sn has low eutectic temperature of approximately 230 C for alloying in Ge and its thermal equilibrium solid solubility is $1% only. As a consequence, the precipitation of metallic Sn clusters and Sn segregation on the GeSn surface is observed at temperatures exceeding the growth temperature.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3] Often the viability of these applications requires process based strain engineering or alloying. Germanium's high hole mobility can be improved through strain engineering, and its small, indirect band gap can be transformed into a direct band gap material by alloying with other elements including tin (Sn).…”
Section: Introductionmentioning
confidence: 99%