Geothermal Drilling Using Reprocessable Shape Memory Polymer Nanocomposite

Lashkari, Reza; Zare, Samira; Tabatabaei‐Nezhad, Seyyed Alireza; Husein, Maen M.

doi:10.2139/ssrn.4379383

Cited by 1 publication

(2 citation statements)

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“…Reza Lashkari et al. [ 8–10 ] synthesized a thermoplastic shape memory polyurethane (SMPU) using polycaprolactone diol (PCL) as soft segment, and explored the SMPU as an LCM, which can be activated at 80 °C to seal wide fractures in wellbores. Moreover, Magzoub et al.…”

Section: Introductionmentioning

confidence: 99%

“…For example, Mansour et al [5] used semicrystalline poly (ethylene-co-methacrylic acid) as an expandable LCM, which can be triggered by a temperature of 70 °C to seal fractures and control fluid losses. Reza Lashkari et al [8][9][10] synthesized a thermoplastic shape memory polyurethane (SMPU) using polycaprolactone diol (PCL) as soft segment, and explored the SMPU as an LCM, which can be activated at 80 °C to seal wide fractures in wellbores. Moreover, Magzoub et al [6,[11][12][13][14] prepared a thermoset shape memory epoxy polymer (SMEP) with an activation temperature of 149 °C, through a reaction of epoxy (EPON 826) with rigid diamine (5-amino-1,3,3trimethylcyclohexanemethylamine, IPD).…”

Section: Introductionmentioning

confidence: 99%

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High Performance Shape Memory Epoxy Syntactic Foam Composites as Lost Circulation Material in Deep Drilling

Ma,

Ren,

Wang

et al. 2023

Macro Materials & Eng

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Lost circulation is a critical issue in drilling. This work reports the investigations on shape memory epoxy polymers (SMEPs) with high switching temperatures, and good thermal, mechanical and shape memory properties for plugging in deep drilling. The SMEPs are produced by curing diglycidyl ether of bisphenol A (DGEBA) and castor oil glycidyl ether (COGE) with a flexible poly(oxypropylene) diamine (D230) and a rigid 4, 4′ ‐diaminodiphenyl methane (DDM). Increasing D230 contents or using COGE, glass transition temperature (Tg, 93–163 °C, DMA analyses) and crosslink density of SMEPs are reduced, shape recovery rate is increased, while tensile strength, elongation at break and impact strength are improved. Further, shape memory epoxy syntactic foams (SMEFs) with high‐temperature adhesion are developed by introducing polymer microspheres into SMEPs. The SMEFs have compression ratio of 52–58%, and expansion ratio of 100% by adding 2% wt. microspheres. They retain the Tg and thermal stability of SMEPs, and show a delayed, slower recovery than SMEPs. Long fracture plugging experiments exhibit that a pressure‐bearing capability of 8.99–9.81 MPa is achieved with SMEFs in sealing fracture slots at a high temperature.

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Section: Introductionmentioning

confidence: 99%