Geometry influence on corrosion in dynamic thin film electrolytes

Simillion, Hans; Steen, Nils Van den; Terryn, Herman; Deconinck, Johan

doi:10.1016/j.electacta.2016.04.072

Cited by 46 publications

(35 citation statements)

References 32 publications

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“…For the corrosion under thin electrolyte layers, the convection is usually neglected, since the electrolyte is assumed stagnant and thin enough to neglect the effect of natural convection. 103 However, the convection could apparently affect the ion transport during the ECM process in condensed conditions. E.g., a strong convection could be caused by the collapse of hydrogen bubbles derived from the H + reduction at the cathode.…”

Section: Ion Transportmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: Ion Transportmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…34 In this equation, c of the diffusion coefficient of oxygen on the salt concentration was added by 35 …”

Section: Physics and Modelmentioning

confidence: 99%

Comparing Modeled and Experimental Accelerated Corrosion Tests on Steel

Steen

Simillion

Thierry

et al. 2017

J. Electrochem. Soc.

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Four different accelerated corrosion tests on steel are simulated with a Dynamic Electrolyte Film Corrosion model. Based on the time dependent temperature and humidity, combined with the presence of hygroscopic salts, a time dependent electrolyte thickness is calculated. At every timestep, the modeled film thickness dictates the corrosion current. Focussing on the thickness predictions, an elementary corrosion model is adopted to enable the corrosion depth estimations. The trends of the simulated corrosion depths are compared with experimental data obtained with an electrical resistance corrosion sensing system, demonstrating the importance of the electrolyte thickness and composition for a thorough understanding and modeling of atmospheric corrosion on steel.

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“…In this latter case, it first increased with reduced WL and then reached at peak value at WL∼25 μm before decreasing with further deceases in WL. The value of WL at which peak ORR current density appeared was then modified to 10 μm (Figure 9[b]) by Simillion, et al, 117 considering changes in ion diffusivity with solution concentration which Dolgikh, et al, 115 did not take into account. However, the modeling predicted current was much higher than that obtained in the experiment for thinner layers which was speculated to be caused by electrode poisoning due to chloride ion during experiment.…”

Section: Atmospheric Localized Corrosionmentioning

confidence: 99%

A Review of the Application of Finite Element Method (FEM) to Localized Corrosion Modeling

Kelly

2019

CORROSION

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The modeling of localized corrosion has usually focused on calculating the spatial and/or temporal distributions of chemical species, potential, and current. These are affected by the reactions considered, the geometry, and the modes of mass transport of importance. Finite element method (FEM) is a numerical technique to obtain approximate solutions to the differential equations based on different types of discretization in which the domain of interest is divided into different types of elements. The introduction of the FEM opened a variety of opportunities for increasing the complexity, and therefore the fidelity, of the localized corrosion conditions considered. This article first briefly introduces the FEM technique before describing the choices the modeler has with regards to the governing equations for the system. The history of the application of FEM to localized corrosion is given, highlighting the different aspects of localized corrosion that have been successfully modeled. Finally, some of the current challenges in FEM modeling of localized corrosion are outlined.

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Geometry influence on corrosion in dynamic thin film electrolytes

Cited by 46 publications

References 32 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Comparing Modeled and Experimental Accelerated Corrosion Tests on Steel

A Review of the Application of Finite Element Method (FEM) to Localized Corrosion Modeling

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