Geometrical and electrical properties of NTC polycrystalline thermistors vs. Changes of sintering parameters

Savić, S.; Aleksić, O.S.; Nikolić, P.M.; Lukovic, D.

doi:10.2298/sos0603223s

Cited by 9 publications

(6 citation statements)

References 1 publication

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“…The paste was composed of pure nickel manganite (NiMn 2 O 4 ) sub‐micron powder and 4 percent boron‐lead‐silicon glass powder and an organic vehicle (3K3 95/2, EI Iritel). The nickel manganite powder has previously been fully analyzed and characterized (Savic et al , 2006, 2008; Nikolic et al , 2007). The top view and cross section of the segmented thermistor are given in Figure 1.…”

Section: Experimental and Resultsmentioning

confidence: 99%

Micro‐flow sensor for water using NTC thick film segmented thermistors

Aleksić¹,

Savić²,

Nikolić³

et al. 2009

Microelectronics International

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PurposeThe purpose of this paper is to apply negative thermal coefficient (NTC) thick film segmented thermistors (TFSTs) in a micro‐flow sensor for water.Design/methodology/approachA TFST is printed using NTC paste based on nickel manganite. The resistance of this thermistor is measured in a climatic chamber and the resulting curves are calibrated. A micro‐flow sensor is designed using a self‐heated segmented thermistor. The sensing principle is based on heat loss depending on the water flow intensity through the capillary. Water flow calibration is performed. The sensor sensitivity, inertia, and stability are analyzed.FindingsThe micro‐flow sensor exhibits good stability, suitable sensitivity, and inertia for integral measurements of water flow.Practical implicationsAdvantages of a micro‐flow sensor using a TFST include low energy consumption, simple measuring procedure, and passive electronics.Originality/valueThis paper describes initial work on a micro‐flow sensor for water using TFSTs.

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Section: Experimental and Resultsmentioning

confidence: 99%

Micro‐flow sensor for water using NTC thick film segmented thermistors

Aleksić¹,

Savić²,

Nikolić³

et al. 2009

Microelectronics International

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“…Moreover our contribution to thick film thermistor layers includes not only substitution of basic oxides with other oxides but development of pastes based on thermistor nanopowders [56]. The sintered thermistors electronic properties were measured by FIR spectrometers [57,58], Hall effect measurement [59], electrical measurement (activation energy) [60] and photoacoustic spectroscopy (PA). The thermistor material thermal diffusivity was also determined for the first time by PA [61][62][63].…”

Section: Thick Film Thermistor Pastesmentioning

confidence: 99%

Recent advances in NTC thick film thermistor properties and applications

Aleksic

Nikolić

2017

FACTA U EE

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An introduction to thermal sensors and thermistor materials is given in brief. After that novel electrical components such as thick film thermistors and thermal sensors based on them are described: Custom designed NTC thermistor pastes based on nickel manganite NiM 2 O 4 micro/nanostructured powder were composed and new planar cellbased (segmented) constructions were printed on alumina. The thick film segmented thermistors were used in novel thermal sensors such as anemometers, water flow meters, gradient temperature sensor of the ground, and other applications. The advances achieved are the consequence of previous improvements of thermistor material based on nickel manganite and modified nickel manganite such as Cu 0.2 Ni 0.5 Zn 1.0 Mn 1.3 O 4 and optimization of thick film thermistor geometries for sensor applications. The thermistor powders where produced by a solid state reaction of MnCO 3 , NiO, CuO, ZnO powders mixed in proper weight ratio. After calcination the obtained thermistor materials were milled in planetary ball mils, agate mills and finally sieved by 400 mesh sieve. The powders were characterized by XRD and SEM. The new thick film pastes where composed of the powders achieved, an organic vehicle and glass frit. The pastes were printed on alumina, dried and sintered and characterized again by XRD, SEM and electrical measurements. Different thick film thermistor constructions such as rectangular, sandwich, interdigitated and segmented were printed of new thermistor pastes. Their properties such as electrical resistance of the thermistor samples where mutually compared. The electrode effect was measured for all mentioned constructions and surface resistance was determined. It was used for modeling and realizations of high, medium and low ohmic thermistors with different power dissipation and heat loss. Finally all the results obtained lead to thermal sensors based on heat loss for measuring the air flow, water flow, temperature gradient and heat transfer from the air to the ground.

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“…The main carriers in NiMn 2 O 4 are small polarons (partly polarized) electrons and the energy gap has a relatively low value (around 0.5 eV) [15][16][17][18]. The disk and chip NTC thermistors for the low temperature application range are pressed out of NiMn 2 O 4 powder in molds and sintered at 1100 • C to 1200 • C/2 h in air [19,20]. The electrodes for disk and chip thermistors Sensors 2024, 24, 3547 2 of 13 are printed out of thick film conductive PdAg paste on both sides.…”

Section: Introductionmentioning

confidence: 99%

“…Sensors 2024, 24, x FOR PEER REVIEW 2 of 14 the low temperature application range are pressed out of NiMn2O4 powder in molds and sintered at 1100 °C to 1200 °C/2 h in air [19,20]. The electrodes for disk and chip thermistors are printed out of thick film conductive PdAg paste on both sides.…”

Section: Introductionmentioning

confidence: 99%

Thermally Coupled NTC Chip Thermistors: Their Properties and Applications

Bodić,

Aleksić,

Rajs

et al. 2024

Sensors

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Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self–heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart–Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.

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Geometrical and electrical properties of NTC polycrystalline thermistors vs. Changes of sintering parameters

Cited by 9 publications

References 1 publication

Micro‐flow sensor for water using NTC thick film segmented thermistors

Micro‐flow sensor for water using NTC thick film segmented thermistors

Recent advances in NTC thick film thermistor properties and applications

Thermally Coupled NTC Chip Thermistors: Their Properties and Applications

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