“…However, it can not satisfy the requirements of high speed and high precision packaging due to the inherent contradictions of the algorithm between the speed and accuracy [26]. The feature-based template matching method utilizes certain image features, thus reducing the amount of calculation, so it shows great potential in the applications of microelectronic bonding [27]. However, under extreme working conditions of packaging, an effective image preprocessing method to obtain robustness image features quickly and accurately and the micro vision alignment approach are still not presented systematically, which is the motivation of this study.…”