2012 IEEE/ACM Sixth International Symposium on Networks-on-Chip 2012
DOI: 10.1109/nocs.2012.28
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Generic Monitoring and Management Infrastructure for 3D NoC-Bus Hybrid Architectures

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Cited by 12 publications
(5 citation statements)
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“…3D Network-on-chip (3D NoC) [4], [5] has been proposed as a promising way to solve on-chip communication bottleneck. Topology [6], [7] and routing algorithm [8], [9], [10] have become two important parts of 3D NoC design. In 3D topology architectures [11], [12], [13], [14] different layers are connected using through silicon vias (TSVs) [15], [16].…”
Section: Introductionmentioning
confidence: 99%
“…3D Network-on-chip (3D NoC) [4], [5] has been proposed as a promising way to solve on-chip communication bottleneck. Topology [6], [7] and routing algorithm [8], [9], [10] have become two important parts of 3D NoC design. In 3D topology architectures [11], [12], [13], [14] different layers are connected using through silicon vias (TSVs) [15], [16].…”
Section: Introductionmentioning
confidence: 99%
“…In a multi-processors system, the cache-coherent shared memory protocols (such as directory-based or token-based) require one-to-many or broadcast communications to require shared data or invalidate shared data on diverse cache blocks [1]. It has been stated that only 3-5% multicast traffic will have a serious impact on system performance in the total network traffic [1].…”
Section: Introductionmentioning
confidence: 99%
“…It takes advantage of the short inter-layer distances that are characteristic of 3D ICs. In stacked mesh architecture, a six-port router is required instead of a seven port one for typical 3D NoC router, and vertical communication is just one hop away to any destination layer [11]. The single-hop and broadcast-based interlayer communication offers a unique and hitherto previously unexplored way to implement an efficient multicast routing for 3D networks-on-chip.…”
Section: Introductionmentioning
confidence: 99%