Generic Heterogeneous Integration Process Flow for Commercial Foundry Low-Index Photonic Platforms

Abstract

We demonstrate a generic heterogeneous integration process flow for low-index photonic platforms, based on a two-step microtransfer printing approach. In this work, a silicon coupler is used for low-loss integration of III/V on silicon nitride.

Low Repetition Rate Mode-Locked Laser on a Commercial Foundry Low-Index Photonic Platform

“…(a) and (b). In [5], two approaches were proposed for the implementation of a silicon coupling structure serving as intermediate layer: transfer printing fully patterned silicon coupling structures and transferring silicon slab coupons which are patterned after printing on the target sample. In this work, we used the latter as it enabled higher lateral alignment accuracy at the cost of some additional processing steps on the target sample.…”

High-Yield Heterogeneous Integration of Silicon and Lithium Niobate Thin Films

“…The realization of such devices on commercial foundry platforms depends critically on the ability to integrate thin films such as silicon or lithium niobate on passive photonic circuits. For example, due to the low refractive index of silicon nitride compared to that of III-V semiconductors, an intermittent silicon coupling layer is indispensable to ensure efficient evanescent coupling between a silicon nitride waveguide and a III-V waveguide [8]. Furthermore, microtransfer printing thin film lithium niobate layers enables exploitation of its strong electro-optical and nonlinear properties on the same photonic chip [3].…”