Generating nonlinear conductive characteristics of micro-silicon carbide/silicone elastomer composites at high temperature utilizing nano-AlN fillers

Wang, Qilong; Chen, Xiangrong; Huang, Xiaofan; Paramane, Ashish; Ren, Na

doi:10.1016/j.matlet.2022.132423

Cited by 1 publication

(1 citation statement)

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“…In a similar experiment, Q. Wang et al [90] found that when micro SiC fillers are incorporated in elastomers, the maximum field intensity is lowered, and thermal performance is improved. However, the composite's tensile strength is reduced due to the appearance of defects on the large-sized microparticles-matrix interface, and the nonlinear conductivity characteristic is lost at high temperatures because the conductive paths are damaged due to aggressive movement of molecular chains [91]. Therefore, incorporating nanofillers into the polymer matrix is the best way to reduce the electric field stress at TP without compromising the breakdown strength, mechanical stability, and thermal performance.…”

Section: Ieee Transactions On Dielectrics and Electrical Insulationmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

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Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap (UWBG) materials. These materials, like silicon carbide (SiC), aluminum nitride (AlN), and diamond, offer advantages with higher power density, decreased weight, and expanded operational abilities regarding temperature, voltage, and frequency. However, the pursuit of pushing these limits confronts challenges within insulation systems, which may struggle to endure the demands of these parameters, potentially resulting in unfavorable conditions like high electric field, space charge accumulation, electrical treeing, and partial discharge (PD), leading to insulation failure. The emphasis of this paper is to review the insulation challenges within (U)WBG power modules and recent research in mitigating the electric field stress at triple points (TPs) and resolving the PD issues. The manuscript first discusses the high electric field stress issue at triple points. Then, ceramic substrate materials, encapsulation materials, and the influence of harsh weather conditions on them are reviewed. The space charge, electrical treeing, and PD issues within encapsulation materials are analyzed under practical operation conditions of (U)WBG power modules like high frequency, temperature, and square wave pulses. Finally, the various strategies to alleviate the associated insulation challenges are meticulously discussed. While the identified mitigation strategies are able to strengthen insulation systems for packaging, their validation under actual operational conditions of (U)WBG power modules remains relatively unexplored, representing a potential avenue for further investigation. This review offers a valuable framework by providing the constraints of the current studies and recommendations for the future that can be utilized as a reference point for future research endeavors. Index Terms-(U)WBG power module packaging, partial discharge, triple points, encapsulation material, electric field stress, high power density, field grading materials, nonlinear field-dependent conductivity layerThis paragraph of the first footnote will contain the date on which you submitted your paper for review, which is populated by IEEE.

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Section: Ieee Transactions On Dielectrics and Electrical Insulationmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

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show abstract

Generating nonlinear conductive characteristics of micro-silicon carbide/silicone elastomer composites at high temperature utilizing nano-AlN fillers

Cited by 1 publication

References 10 publications

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

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