Generating micro-dimples array on the hard chrome-coated surface by modified through mask electrochemical micromachining

Qian, Shuqu; Zhu, Daiyin; Qu, Ningsong; Li, Hansong; Yan, Dongsheng

doi:10.1007/s00170-009-2246-x

Cited by 81 publications

(24 citation statements)

References 14 publications

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“…Qian el al. [21] showed that by using a 100-μm-thick mask with micro-holes of 200 μm diameter, the diameter of the micro-dimples increased from 230 to 310 μm with increasing voltage. In contrast, with the method described here, there was no increase in diameter with increasing voltage, which indicates high machining accuracy.…”

Section: Undercutting Of Micro-dimples Generated With Direct Currentmentioning

confidence: 97%

Reduction of undercutting in electrochemical micro-machining of micro-dimple arrays by utilizing oxygen produced at the anode

Chen

Fang

et al. 2015

Surface and Coatings Technology

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Section: Undercutting Of Micro-dimples Generated With Direct Currentmentioning

confidence: 97%

Reduction of undercutting in electrochemical micro-machining of micro-dimple arrays by utilizing oxygen produced at the anode

Chen

Fang

et al. 2015

Surface and Coatings Technology

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“…Chen et al [11] showed that for TMEM M, the ratio of etched micro-dimple diameter to maskhole diameter was 1.23 at an etched depth of 3 μm. Qian et al [12], using a low-cost modified TMEMM technique, reported a ratio of etched micro-dimple diameter It can clearly be seen that EF decreases with prolonged machining time. This is because of the increase in overcut with increasing machining time.…”

Section: Effect Of Machining Time On the Micro-dimple Arraymentioning

confidence: 99%

“…Chen et al [11] reported the application of a polydimethysiloxane mask for the production of a micro-dimple array 61.5 μm in diameter and 3 μm in depth by using TMEMM. Qian et al [12] prepared micro-dimple arrays 280 μm in diameter and 12 μm in depth using a low-cost modified TMEMM technique in which an insulation sheet with through-holes, coated with a conductive metal layer, was used as a mask.…”

Section: Introductionmentioning

confidence: 99%

Investigation of machining accuracy of micro-dimples fabricated by modified microscale pattern transfer without photolithography of substrates

Zhang

et al. 2015

Int J Adv Manuf Technol

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Micro-dimples are among the basic microfeatures that have been applied to different products in various fields. The product performance and service life of textured surfaces are directly affected by size, location, and density. A modified microscale pattern transfer process without photolithography of substrates, through the use of movable dry-film mask electrochemical micromachining, has been proposed for the production of micro-dimples. This paper investigates the influence of electrochemical micromachining parameters, namely, applied voltage and machining time on the machining accuracy of micro-dimples produced using this technique. Experimental results indicate that the machining accuracy deteriorates with prolonged machining time and increasing applied voltage. It is found that to obtain high machining accuracy when machining micro-dimples of similar depth, a combination of higher current density with reduced machining time is recommended.

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“…To eliminate the use of the adhesive mask and thus to simplify the TM-ECM process, Zhu et al [5,6,7,8] innovatively utilized the active through-mask that can be removed from the anode and reused repeatedly, and studied experimentally and numerically its effects on the dissolution behaviors and machining accuracy. However, fixing such removable mask could be a challenging task.…”

Section: Introductionmentioning

confidence: 99%

Effect of Outflow Mode on Machined Micro-dimple in the Through-mask Electrochemical Micromachining with Filled Inter-electrode Gap

Zhao¹,

Ming²,

Zhou³

et al. 2017

Proceedings of the 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)

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Keywords: Through-mask electrochemical micromachining, Flexible porous material, Outflow mode of electrolyte, Micro-dimple arrays. Abstract.To analyse the effect of outflow modes during making micro-dimples using the modified through-mask electrochemical machining with filled inter-electrode gap, some investigations were carried out numerically and experimentally. The studies showed that, the reflux discharging mode (RDM), which allows most of the electrolyte and electrolytic products to flow out through the holes arranged inside the cathode, can produce fairly more homogeneous flow field and smoother mass transfer during machining, compared with the conventional mode in which the electrolyte and electrolytic products can be discharged only from the inter-electrode gap. Micro-dimples generated on the basis of RDM show a flat bottom feature without island defect and smooth surfaces as well as good dimension uniformity.

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Generating micro-dimples array on the hard chrome-coated surface by modified through mask electrochemical micromachining

Cited by 81 publications

References 14 publications

Reduction of undercutting in electrochemical micro-machining of micro-dimple arrays by utilizing oxygen produced at the anode

Reduction of undercutting in electrochemical micro-machining of micro-dimple arrays by utilizing oxygen produced at the anode

Investigation of machining accuracy of micro-dimples fabricated by modified microscale pattern transfer without photolithography of substrates

Effect of Outflow Mode on Machined Micro-dimple in the Through-mask Electrochemical Micromachining with Filled Inter-electrode Gap

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