“…To enhance better performance of diamond electronic devices, an excellent ohmic contact between electrode metal layer and diamond is needed 9,19–24 . Up to now, many investigations of ohmic contact between metal and diamond have been reported, such as gold (Au), platinum (Pt) and palladium (Pd) on hydrogen-terminated single crystal diamond, all of which yield important role in diamond device development so far 9,25,26 . However, Au could peel off during fabrication process, which indicates quite poor adherence of Au on hydrogen-terminated single crystal diamond film 9 .…”