2023
DOI: 10.1109/tpel.2022.3198291
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Gate Oxide Degradation Condition Monitoring Technique for High-Frequency Applications of Silicon Carbide Power MOSFETs

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Cited by 10 publications
(3 citation statements)
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“…However, it is worth noting that these systems tend to be cost-intensive due to their requirement for transducing rapidly changing physical quantities. This is especially true for SiC MOSFET, which can exhibit dynamics reaching even MHz levels in resonant converters [9][10][11][12][13][14][15][16][17][18][19]. This approach offers precise parameter aging estimation but demands a tailored design for the integrated measurement system within the power converter.…”
Section: State Of the Art Overviewmentioning
confidence: 99%
“…However, it is worth noting that these systems tend to be cost-intensive due to their requirement for transducing rapidly changing physical quantities. This is especially true for SiC MOSFET, which can exhibit dynamics reaching even MHz levels in resonant converters [9][10][11][12][13][14][15][16][17][18][19]. This approach offers precise parameter aging estimation but demands a tailored design for the integrated measurement system within the power converter.…”
Section: State Of the Art Overviewmentioning
confidence: 99%
“…Also, the turn-on time and gate leakage current rise [19], [20]. Moreover, in the case of SiC MOSFET, the voltage between the drain and source also changes [21], [22]. Therefore, the aging degree of the switching devices is estimated using these aging indicators: on-resistance, turn-on time, gate leakage current, drain and source voltage, etc.…”
Section: A Model Predictive Control In Abc Frame Figure 1 Three-phase...mentioning
confidence: 99%
“…Poor oxide quality and integrity can result in current leakage, which has a detrimental impact on device performance. [4][5][6] Currently, thermal nitride SiO 2 , which boasts ultra-low leakage current, is widely utilized as the material for the gate oxide. [7][8][9] Nevertheless, its relatively low dielectric constant compared to the SiC substrate can result in electrical breakdown prior to the SiC breakdown field being reached, hindering its suitability for high-power applications.…”
Section: Introductionmentioning
confidence: 99%