“…‚ Improving the reliability of operation close to thermal restrictions ‚ Achieving a more reasonable difference between the maximum junction temperature throughout the operation and the nominal junction temperature ‚ Enhancing the operation performance during transient at thermal restrictions Decrease in thermal cycle Manipulation in terms of the following: -Switching power loss: • Gate resistance ( [210], [223], [224]), • Frequency ( [27], [28], [45], [46], [216], [210], [225], [226], [227], [228], [229]), • Gate drivers ( [32], [230], [222], [231], [232], [233], [234], [235]), • Shoot-through duty ratio ( [233]).…”