2003
DOI: 10.1557/proc-792-r10.7
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Gas Cluster Ion Beam Processing of GaSb and InSb Surfaces

Abstract: Gas Cluster Ion Beam (GCIB) processing has recently emerged as a novel surface smoothing technique to improve the finish of chemical-mechanical polished (CMP) GaSb (100) and InSb (111) wafers. This technique is capable of improving the smoothness CMP surfaces and simultaneously producing a thin desorbable oxide layer for molecular beam epitaxial growth. By implementing recipes with specific gas mixtures, cluster energy sequences, and doses, an engineered oxide can be produced. Using GaSb wafers with a high qua… Show more

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Cited by 2 publications
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“…4,5,6 After successful oxide desorbtion, GaSb/AlGaSb heteroepitaxial layers were grown at a substrate temperature of ~500ºC for a total thickness of ~1 µm. Surface topographies, with scan resolutions of 10 x 10, 1 x 1, and 0.1 x 0.1 µm 2 , were acquired using a Digital Nanoscope AFM providing the rms roughness (R rms ) and maximum peak-to-valley range (∆Z).…”
Section: Methodsmentioning
confidence: 99%
“…4,5,6 After successful oxide desorbtion, GaSb/AlGaSb heteroepitaxial layers were grown at a substrate temperature of ~500ºC for a total thickness of ~1 µm. Surface topographies, with scan resolutions of 10 x 10, 1 x 1, and 0.1 x 0.1 µm 2 , were acquired using a Digital Nanoscope AFM providing the rms roughness (R rms ) and maximum peak-to-valley range (∆Z).…”
Section: Methodsmentioning
confidence: 99%
“…3 Lateral sputtering by GCIB is now being used for low-damage atomic-scale surface smoothing 10,13,15. ͑a͒ Normal incidence and ͑b͒ oblique incidence.FIG.…”
mentioning
confidence: 99%