Gas Chromatographyof o-, m-and p-Dinitrobenzene Mixtures

Suzuki, Y.; Yoshikuni, Nobutaka; Takeuchi, Tsugio

doi:10.1246/nikkashi1898.71.11_1841

Cited by 2 publications

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“…The flecks on the film and the grown grains in the film were observed by an optical microscope. Thermal recrystallization test of the films (1,3,6,10,20, 40 and 80µm thick) which were deposited on the same Nickel specimen (Fig. 1) by the same procedure, was carried out at 500℃ for 1.5h in Argon gas.…”

Section: Methodsmentioning

confidence: 99%

“…It has been established by metallographic and X-ray investigations that the fleck formation is due to grain growth in the film by cyclic stressing [2] associated with texture formation [3]. The phenomena has been successfully applied to an experimental stress and strain analysis [4][5][6][7][8][9][10][11]. The technique is called the electroplating method.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Thickness on Grain Growth in Electrodeposited Copper Film by Cyclic Stressing

Iino

2005

KEM

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Effect of thickness on grain growth in Copper electrodeposits by cyclic stressing was studied by metallographic observation. The thickness of the film was 1µm to 20µm and the number of stress cycles was 3 × 106. Recrystallization by annealing in the films was also examined for comparison. The results show that the nucleation of the grains by cyclic stressing decreases significantly with decreasing thickness, while the grain growth rate is almost independent of thickness. The recrystallized grain size by annealing decreases with decreasing film thickness and is always smaller than the film thickness. The difference in the structural change by cyclic stressing and by annealing is discussed. When the crystal growth caused by cyclic stressing is used as a strain analysis method, the optimum thickness of the deposits is about 10µm.

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Section: Methodsmentioning

confidence: 99%