GaN smart power devices and integrated circuits

We have evaluated specific on-state resistance (Ron,sp) and switching performance of various GaN power field-effect transistors (FETs) with 600 and 1200 V ratings using analytical calculation and numerical simulation. The normally-off GaN power FET family includes lateral p-GaN gate high electron mobility transistors (HEMTs), lateral metal-oxide-semiconductor (MOS) channel HEMTs, current aperture vertical electron transistors (CAVETs) and vertical U-shaped trench-gate MOS field-effect transistors (UMOSFETs). This study shows the advantages of vertical GaN power FETs over lateral GaN power HEMTs. These advantages include lower Ron,sp and smaller switching energy loss, especially at higher blocking voltages (1200 V). At 600 V, lateral P-GaN gate HEMTs are competitive with vertical power FETs. Vertical GaN CAVETs perform better than both lateral HEMTs and vertical UMOSFETs at both voltage ratings, benefiting from its lowest Ron*QG figure-of-merit.

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GaN smart power devices and integrated circuits

Cited by 2 publications

References 95 publications

Monolithically Integrated GaN LED/Quasi-Vertical Power U-Shaped Trench-Gate MOSFET Pairs Using Selective Epi Removal

Monolithically Integrated GaN LED/Quasi-Vertical Power U-Shaped Trench-Gate MOSFET Pairs Using Selective Epi Removal

Comparative performance evaluation of lateral and vertical GaN high-voltage power field-effect transistors

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