The galvanic contact deposition of ZnO was carried out by immersing a conductive substrate short-circuited with a Zn rod into O 2 -saturated aqueous Zn͑ClO 4 ͒ 2 solutions, and the deposition behaviors were investigated in comparison with that in Zn͑NO 3 ͒ 2 . The dissolution of the Zn rod in the Zn͑ClO 4 ͒ 2 solutions supplied a continuous and almost constant current to the substrate, allowing the cathodic electrodeposition of ZnO without an external power and by-products. 19 has been synthesized by applying the technique. Moreover, the epitaxial growth of ZnO has also been attained by using lattice-matched substrates. [20][21][22] In these ZnO electrodepositions, cathodic electrolysis is employed in an aqueous Zn͑NO 3 ͒ 2 or ZnCl 2 solution, and the deposition mechanism is based on the increase in local pH in the vicinity of an electrode, followed by hydrolysis of zinc ions to give ZnOSuch a local deposition fashion can, therefore, prevent precipitation in the bulk of solution unlike chemical bath deposition and hydrothermal synthesis. To raise the local pH, the cathodic reduction of dissolved oxygen ͑DO͒ and nitrate ion, which gives hydroxide ion, is generally utilizedand an external power, i.e., potentiostat/galvanostat, is employed to control the electrolysis. Recently, Mondal et al. 23 reported a unique electrochemical process to deposit ZnO without external power through a "galvanic contact method," also referred to as the "contact immersion method." In this method, a working substrate is short-circuited to an auxiliary electrode, of which the potential when immersed into the deposition bath is negative to the Nernst potential of the cathodic reaction desired on the working substrate. The galvanic contact method is, therefore, a kind of "short-circuited galvanic cell" and generally offers a "semipotentiostatic condition" without a set of potentiostat and reference electrodes. So far, metals, alloys, and metallic calcogenides, such as Cu-Sn, 24 CdTe, [25][26][27][28] and CdSe, 29 have been synthesized by using galvanic contact methods. In the literature, 23 a metallic zinc rod as an anode and transparent conductive oxide-coated ͑TCO͒ glass substrate as a cathode were immersed into a 10 mM ͑M = mol dm −3 ͒ Zn͑NO 3 ͒ 2 solution at 60-80°C, and then the two electrodes were just short-circuited to deposit ZnO. The driving force to promote the ZnO deposition is the dissolution of zinc ions from metallic zinc, which supplies electrons to the TCO glass, reducing nitrate ions. However, Mondal et al. 23 reported that the growth of ZnO stopped at a layer thickness of ϳ0.6 m due to the electrical resistance of ZnO, which becomes higher with increasing thickness.Nonetheless, this system is potentially interesting because one can obtain an external power-free solution process. Furthermore, by not using nitrate ion but using DO to raise the local pH, the following overall reaction is given Zn + 1/2O 2 → ZnO ͓4͔ resulting in a no by-product process that keeps the Zn 2+ concentration constant ͑Fig. 1͒. Therefore, the dev...