2014
DOI: 10.1063/1.4891375
|View full text |Cite
|
Sign up to set email alerts
|

Gallium phosphide as a new material for anodically bonded atomic sensors

Abstract: Miniaturized atomic sensors are often fabricated using anodic bonding of silicon and borosilicate glass. Here we describe a technique for fabricating anodically bonded alkali-metal cells using GaP and Pyrex. GaP is a non-birefringent semiconductor that is transparent at alkali-metal resonance wavelengths, allowing new sensor geometries. GaP also has a higher thermal conductivity and lower He permeability than borosilicate glass and can be anodically bonded below 200 °C, which can also be advantageous in other … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
5
0

Year Published

2016
2016
2023
2023

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 13 publications
(5 citation statements)
references
References 15 publications
0
5
0
Order By: Relevance
“…A droplet of alkali metal is used to block the stem of the cell and we position the droplet with independent temperature control of the cell and stem in order to minimize spinrelaxation of 3 He due to dipolar fields created by its own magnetization. The cell is heated in a boron nitride oven with GaP windows [34] using thick film resistive heaters driven by AC currents at 120 kHz. The oven is placed in an inner ferrite shield and 3 outer µ-metal magnetic shields [35].…”
Section: Experimental Apparatusmentioning
confidence: 99%
See 1 more Smart Citation
“…A droplet of alkali metal is used to block the stem of the cell and we position the droplet with independent temperature control of the cell and stem in order to minimize spinrelaxation of 3 He due to dipolar fields created by its own magnetization. The cell is heated in a boron nitride oven with GaP windows [34] using thick film resistive heaters driven by AC currents at 120 kHz. The oven is placed in an inner ferrite shield and 3 outer µ-metal magnetic shields [35].…”
Section: Experimental Apparatusmentioning
confidence: 99%
“…The cell is heated in a boron nitride oven with GaP windows [34] using thick film resistive heaters driven by AC currents at 120 kHz. The oven is placed in an inner ferrite shield and 3 outer µ-metal magnetic shields [35].…”
Section: Experimental Apparatusmentioning
confidence: 99%
“…In order to make larger cells, a glass interposer with a hole drilled through it can be bonded to two etched silicon wafers, onto which the glass windows are bonded in turn. 150 GaP can also be used as the wall of the cell preform 151 if high thermal conductivity and low helium permeation are required. Glass can be bonded onto GaP at about 200 C, making this material useful for low-temperature cell filling also.…”
Section: Alternative Cell Geometriesmentioning
confidence: 99%
“…Due to the helium permeation of glass substrate, the measured leak rate is much larger than the actual air or oxygen leak rate with atmosphere. There are several approaches to overcome this problem, such as applying aluminosilicate glass instead of borosilicate glass [ 55 ], using gallium phosphide and Pyrex as sealing materials for anodic bonding [ 56 ], and choosing an alternative gas to implement leak test, while the reported lifetime for microfabricated vapor cells with buffer gas can be over nine months [ 57 , 58 ]. As such, when considering the slowing-down process, the actual lifetime could be much longer than the calculated value.…”
Section: Resultsmentioning
confidence: 99%