Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials

Ki, Seokkan; Shim, Jaehwan; Oh, Seungtae; Koh, Eunjoo; Seo, Donghyun; Ryu, Seunggeol; Kim, Jaechoon; Nam, Youngsuk

doi:10.1016/j.ijheatmasstransfer.2021.121012

Cited by 49 publications

(26 citation statements)

References 46 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[13] Copper nanoparticles incorporated into GaInSn (66% Ga; 22%In; 16%Sn) via an oxide-free ultrasonic-assisted internalization process in HCl solution reached a high κ of 64.8 W m −1 K −1 . [14] In these efforts involving mixing Ga-based liquid metal with fillers of high thermal conductivity, gallium, however, can react with many metals such as copper, [20,21] silver, [22] aluminum, [23] and iron, [16] to form intermetallic compounds (IMCs) due to its reactive nature. For example, in the eutectic gallium indium-copper (EGaIn-Cu) composite system, the reaction between copper and gallium produces CuGa 2 IMCs.…”

Section: Introductionmentioning

confidence: 99%

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

et al. 2021

View full text Add to dashboard Cite

Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1 K−1 is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.

show abstract

Section: Introductionmentioning

confidence: 99%

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

et al. 2021

View full text Add to dashboard Cite

show abstract

“…Despite the improved properties, both the density of Ga-based LMs (EGaIn: 6.25 g cm −3 ; galinstan: 6.44 g cm −3 ) and typically high loading (⩾85 wt%, or ⩾50 vol%) required to achieve the desired functional properties contribute to the high density of LM embedded composites, which can be problematic for largearea and weight-sensitive applications.Recently, researchers have shown that the properties of Gabased LMs can be enhanced through the addition of solid particles. Several LM mixtures have been studied to improve the thermo-mechanical properties [10,11,[40][41][42][43][44][45][46][47][48][49] , rheology and consistency, [50][51][52][53][54][55][56][57][58] and density [58,59] of LM. This has resulted in LM mixtures with high thermal conductivity >100 W m −1 K −1 , a fourfold increase as compared to pure LM, [43,44] LM pastes that can be easily spread on a surface, [40] and LM mixtures that can float on water.…”

mentioning

confidence: 99%

“…Recently, researchers have shown that the properties of Gabased LMs can be enhanced through the addition of solid particles. Several LM mixtures have been studied to improve the thermo-mechanical properties [10,11,[40][41][42][43][44][45][46][47][48][49] , rheology and consistency, [50][51][52][53][54][55][56][57][58] and density [58,59] of LM. This has resulted in LM mixtures with high thermal conductivity >100 W m −1 K −1 , a fourfold increase as compared to pure LM, [43,44] LM pastes that can be easily spread on a surface, [40] and LM mixtures that can float on water.…”

mentioning

confidence: 99%

Lightweight, Thermally Conductive Liquid Metal Elastomer Composite with Independently Controllable Thermal Conductivity and Density

Krings

Zhang

Sarin

et al. 2021

Small

View full text Add to dashboard Cite

gallium-based LM alloys such as EGaIn (eutectic gallium-indium) or galinstan (eutectic gallium-indium-tin) are typically selected as the liquid filler due to the combination of high electrical and thermal conductivity, low viscosity, and nontoxic characteristics. [4][5][6][7] By dispersing LM inclusions into elastomers, functional properties-including thermal conductivity, [8][9][10][11][12][13][14][15] dielectric constant, [16][17][18][19][20][21] and electrical conductivity, [22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39] -can be improved with negligible changes in stiffness and extensibility of the host elastomer, even at high loading. LM embedded composites exhibit a unique combination of functional properties, low stiffness, and high strain limit that overcomes fundamental limitations of soft and deformable materials and offers great promise for emerging applications in soft robotics and wearable computing that require highly functional and elastically deformable materials. Despite the improved properties, both the density of Ga-based LMs (EGaIn: 6.25 g cm −3 ; galinstan: 6.44 g cm −3 ) and typically high loading (⩾85 wt%, or ⩾50 vol%) required to achieve the desired functional properties contribute to the high density of LM embedded composites, which can be problematic for largearea and weight-sensitive applications.Recently, researchers have shown that the properties of Gabased LMs can be enhanced through the addition of solid particles. Several LM mixtures have been studied to improve the thermo-mechanical properties [10,11,[40][41][42][43][44][45][46][47][48][49] , rheology and consistency, [50][51][52][53][54][55][56][57][58] and density [58,59] of LM. This has resulted in LM mixtures with high thermal conductivity >100 W m −1 K −1 , a fourfold increase as compared to pure LM, [43,44] LM pastes that can be easily spread on a surface, [40] and LM mixtures that can float on water. [59] However, LM mixtures that include metallic particles with fcc crystal structures, such as copper (Cu), silver (Ag), iron (Fe with fcc crystal structure), and nickel (Ni), tend to spontaneously react with LM and form intermetallics that solidify at low loading. [10] For LM mixtures with particles that do not form intermetallic species, the rheology and consistency of the mixtures are controlled by the fraction of solid particles that are added to the mixture, resulting in a transition from a liquid to paste-like rheology (⩽50% by volume) or liquid to powder at higher volume loading (>50%). [40,44,52,53,59] The viscosity of the Lightweight and elastically deformable soft materials that are thermally conductive are critical for emerging applications in wearable computing, soft robotics, and thermoregulatory garments. To overcome the fundamental heat transport limitations in soft materials, room temperature liquid metal (LM) has been dispersed in elastomer that results in soft and deformable materials with unprecedented thermal conductivity. However, the high density of LMs (>6 g cm −3 ) and the typical...

show abstract

“…This is because the efficient thermal channel is created by the nanoparticle clusters. [ 96 ] With the heavier mass of the copper particles, its fluidity was decreased, but the electrical conductivity was improved. Shu et al.…”

Section: The Characteristics Of the Combination Of Lms And Tmsmentioning

confidence: 99%

Recent Development of Liquid Metal‐Based Functional Materials Combined with Common Transition Metals

Wang

Guo

Xiao

et al. 2021

Adv Materials Inter

View full text Add to dashboard Cite

Gallium‐based liquid metals (LMs) are a group of metal materials that are in liquid state at room temperature. Their unique physiochemical properties such as fluidity, conductivity, and interfacial properties with other materials have presented great potentials and wide applications. Specifically, the interactions between gallium‐based LMs and some common but important transition metals (TMs) have not only enabled a series of intriguing phenomena but also provided valuable strategies or functional materials in soft robotics, devices, flexible electronics, addictive manufacturing, biomedical engineering and therapies, and other fields. The chemical mechanisms including the galvanic corrosion, infiltration, intermetallic compound formation should play vital roles within these interactions. Hereby the combining the LMs and TMs by alloying or physically mixing may offer a platform to develop novel and multifunctional materials system. To acquire a comprehensive understanding of those interactions as well as to inspire the researches for multifunctional materials design and applications, this article reviews the researches on the combination of LMs and TMs, discusses the characteristics, the mechanisms, and their applications especially in electronics, smart materials, and biomedicine. The main challenges and future research outlook are also discussed.

show abstract

Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials

Cited by 49 publications

References 46 publications

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Lightweight, Thermally Conductive Liquid Metal Elastomer Composite with Independently Controllable Thermal Conductivity and Density

Recent Development of Liquid Metal‐Based Functional Materials Combined with Common Transition Metals

Contact Info

Product

Resources

About