2018
DOI: 10.1016/j.solmat.2017.07.032
|View full text |Cite
|
Sign up to set email alerts
|

GaAsP/Si tandem solar cells: In situ study on GaP/Si:As virtual substrate preparation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

1
3
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
9

Relationship

2
7

Authors

Journals

citations
Cited by 13 publications
(6 citation statements)
references
References 40 publications
1
3
0
Order By: Relevance
“…These results (i.e., presence of oxygen in the interface of Sample 1, whose pre-exposure has the lowest temperature) supports the idea that the temperature plays a role on the deoxidation step [39], [44]. This agrees with previous results [27] in which the effectiveness of AsH 3 in removing oxygen from the surface at temperatures higher than 700 • C was observed by Auger Electron Spectroscopy.…”
Section: Resultssupporting
confidence: 91%
“…These results (i.e., presence of oxygen in the interface of Sample 1, whose pre-exposure has the lowest temperature) supports the idea that the temperature plays a role on the deoxidation step [39], [44]. This agrees with previous results [27] in which the effectiveness of AsH 3 in removing oxygen from the surface at temperatures higher than 700 • C was observed by Auger Electron Spectroscopy.…”
Section: Resultssupporting
confidence: 91%
“…Afterwards, the wafers are exposed to a short flux of AsH 3 (Figure 2d). This so-called pre-exposure step aids in the deoxidation and the elimination of other contaminants as carbon [18][19][20]. In principle, such group-V pre-exposure could be also interesting in order to form a p-n junction for the bottom subcell by the in-diffusion of As into the wafer.…”
Section: Process Rationalementioning
confidence: 99%
“…Si(100) wafers with 2° offcut toward [011] were thermally deoxidized at 1000 °C and 950 mbar . The arsenic-modified, double-layer stepped surface was prepared by annealing the surfaces under the tertiarybutylarsine precursor at 830 °C. ,, Triethylgallium (TEGa), trimethylaluminum (TMAl), and tertiarybutylphosphine (TBP) were used as the precursors for the growth of GaP or GaP/AlP NLs at 420 °C and the subsequent GaP buffer layer growth at 595 °C. The GaP nucleation consisted of 10 alternating precursor pulses each of TBP and TEGa (1 s each with 1 s pause in between) .…”
Section: Experimental and Analysis Methodsmentioning
confidence: 99%
“…Defects in the GaP epilayer related to the polar-on-nonpolar epitaxy, the so called antiphase domains, can be avoided by preparing the Si(100) substrates with a double-layer stepped surface. In order to avoid defects such as stacking faults (SFs), which are errors in the stacking of the atomic planes, and stacking fault pyramids (SFPs), which are composed of four intersecting SFs, the process route of the GaP nucleation and growth must be precisely controlled . Adequate preparation of the Si(100) surface for obtaining antiphase domain-free GaP buffer layers has been shown on Si substrates with various offcut angles (from almost exactly oriented to vicinal substrates) in MOCVD reactors, which contain III–V residuals. , A commonly applied, two-step GaP growth procedure, which should ensure two-dimensional growth with a low density of SFs and SFPs, includes a nucleation step at a low temperature of around 420 °C, followed by the growth at an increased temperature of around 600 °C. ,, It has been shown that the SFs can be formed upon coalescence of GaP islands formed at an early stage during epitaxial growth on Si substrates. , Thus, a smooth GaP/Si heterointerface, which is free of three-dimensional islands, appears highly beneficial.…”
Section: Introductionmentioning
confidence: 99%