1987
DOI: 10.1109/edl.1987.26573
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GaAs E/D MESFET 1-kbit static RAM fabricated on silicon substrate

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Cited by 43 publications
(5 citation statements)
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“…Figure 7(b) s h o w s t h e a c c e s s t i m e measurement waveforms. The measured access time of this SRAM ranged from6 to 14 ns, which is comparable to 3.5 toFigure 6. 1 K SRAM chip fabicated 12 ns observed for bulk GaAs in a GaAs on Si wafer.…”
supporting
confidence: 53%
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“…Figure 7(b) s h o w s t h e a c c e s s t i m e measurement waveforms. The measured access time of this SRAM ranged from6 to 14 ns, which is comparable to 3.5 toFigure 6. 1 K SRAM chip fabicated 12 ns observed for bulk GaAs in a GaAs on Si wafer.…”
supporting
confidence: 53%
“…However, it appears that this aspect of the warpage is not a serious problem. For a 3 u r n thick GaAs layer grown on a 600 um thick 2" Si substrate, the resulting warpage of less than 15 um is acceptable for submicron lithography [6]. The film cracking may be a serious problem, particulary for structures requiring thick layers, such as the laser diodes.…”
Section: Stressmentioning
confidence: 99%
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“…The nonlinearities in the curves under large forward bias are caused by series resistance. The area of Schottky diode is 7.85X 10 -J cm 2 • (IrO) is proportional to V;·8, which suggests that the reverse current is caused by the generation current due to the recombination centers_ The generation current density (J gen ) due to the recombination centers in the depletion region is given by (3) where Te = liN/, Here 7e is the effective lifetime and Nt is the trap density. Similar temperature dependencies of 1-V characteristics are observed in the GaAs/Si grown by the two-step growth technique and by using the SLSs/GaP intermediate layer.…”
Section: Methodsmentioning
confidence: 99%