Ga<sup>+</sup> implantation in a PZT film during focused ion beam micro‐machining

Wollschläger, Nicole; Österle, Werner; Häusler, Ines; Stewart, M

doi:10.1002/pssc.201400096

Cited by 3 publications

(2 citation statements)

References 8 publications

(8 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Unlike femtosecond laser material processing (FLMP), RIE is a sophisticated process that requires the use of reactive, dangerous, and hazardous chemicals. Focused ion beam (FIB) is another method that has been used for high-precision material processing [14,15], including metals such as tungsten [16]. In this method, ions generated from argon or gallium atoms are extracted and focused by an electric field onto the target substrate.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond Laser Machining of an X-ray Mask in a 500 Micron-Thick Tungsten Sheet

Owusu-Ansah,

Dalton

2023

Micromachines

View full text Add to dashboard Cite

Femtosecond laser material processing (FLMP) was used to make an X-ray mask in a 500 µm thick tungsten sheet without the use of any chemical etch methods. The laser produced an 800 nm wavelength at a 1 kHz repetition rate and a pulse width of 100 fs. The laser beam arrival at the tungsten sheet was synchronized to a computer numerically controlled (CNC) stage that allowed for motion in the XYZθ directions. The X-ray mask design was made using CAD/CAM software (Alphacam 2019 R1) and it consisted of linear, circular, and 45° angle features that covered an area of 10 mm × 10 mm. A total of 70 laser beam passes at a moderate laser energy of 605.94 J/cm2 were used to make through-cut features into the tungsten sheet. The morphology of the top view (laser incident, LS) images showed cleaner and smoother cut edges relative to the bottom view (laser exit, LE) images. It was found that the size dimensions of the through-cut features on the LE surfaces were better aligned with the CAD dimensions than those of the LS surfaces. The focused laser beam produced inclined cut surfaces as the beam made the through cut from the LS to the LE of the tungsten sheet. The circular features at the LS surface deviated toward being oval-like on the LE surface, which could be compensated for in future CAD designs. The dependence of the CNC processing speed on the thickness of the etch depth was determined to have a third-order exponential decay relationship, thereby producing a theoretical model that will be useful for future investigators to predict the required experimental parameters needed to achieve a known etch depth in tungsten. This is the first study that has demonstrated the capability of using a femtosecond laser to machine through-cut an X-ray mask in a 500 µm thick tungsten sheet with no involvement of a wet etch or any other such supporting process.

show abstract

Section: Introductionmentioning

confidence: 99%

Femtosecond Laser Machining of an X-ray Mask in a 500 Micron-Thick Tungsten Sheet

Owusu-Ansah,

Dalton

2023

Micromachines

View full text Add to dashboard Cite

show abstract

“…In Pb(Zr,Ti)O 3 , the implantation depth of Ga þ ions on the sides of the lamella is 5 nm at 16 kV and 2 nm at 5 kV. 29 Assuming that 0.4PMN-0.6PT has a behavior similar to Pb(Zr,Ti)O 3 under the ion beam, the thickness of the implanted layer should be between 5 and 2 nm in our case, which is relatively small compared to the total thickness of the lamella. A large part of the lamella remains crystalline, which is supported by the high resolution images.…”

Section: -3mentioning

confidence: 99%

Lattice reorientation in tetragonal PMN-PT thin film induced by focused ion beam preparation for transmission electron microscopy

Denneulin

Maeng

Eom

et al. 2017

Journal of Applied Physics

View full text Add to dashboard Cite

Focused ion beam sample preparation for transmission electron microscopy (TEM) can induce relaxation mechanisms in epitaxial thin films. Here, we describe a relaxation mechanism that can occur in materials having a tetragonal structure. We investigated the lattice structure of a 600 nm thick 0.4[Pb(Mg1/3Nb2/3)O3]−0.6[PbTiO3] layer grown by epitaxy on (110) GdScO3 substrate using geometrical phase analysis applied to high resolution TEM images. The lattice mismatch at the interface is expected to favor the formation of c-domains. However, it was measured that the out-of-plane lattice parameter can decrease abruptly along the growth direction and the transition depends on the thickness of the TEM lamella. Different observations indicate that the crystal flipped by 90° following the preparation of the sample, so that the c-axis is oriented in the thinning direction. Such a mechanism can easily lead to misinterpretations and might happen in other materials with a similar structure.

show abstract

Non-conventional Small-Scale Mechanical Testing of Materials

et al. 2022

View full text Add to dashboard Cite

Ga⁺ implantation in a PZT film during focused ion beam micro‐machining

Cited by 3 publications

References 8 publications

Femtosecond Laser Machining of an X-ray Mask in a 500 Micron-Thick Tungsten Sheet

Femtosecond Laser Machining of an X-ray Mask in a 500 Micron-Thick Tungsten Sheet

Lattice reorientation in tetragonal PMN-PT thin film induced by focused ion beam preparation for transmission electron microscopy

Non-conventional Small-Scale Mechanical Testing of Materials

Contact Info

Product

Resources

About

Ga+ implantation in a PZT film during focused ion beam micro‐machining

Cited by 3 publications

References 8 publications

Femtosecond Laser Machining of an X-ray Mask in a 500 Micron-Thick Tungsten Sheet

Femtosecond Laser Machining of an X-ray Mask in a 500 Micron-Thick Tungsten Sheet

Lattice reorientation in tetragonal PMN-PT thin film induced by focused ion beam preparation for transmission electron microscopy

Non-conventional Small-Scale Mechanical Testing of Materials

Contact Info

Product

Resources

About

Ga⁺ implantation in a PZT film during focused ion beam micro‐machining