G-Band Diplexer Based on E-Plane Waveguide Structures

Chen, Xiong; Hu, Jian; Xiang, Le

doi:10.23919/piers.2018.8597690

Cited by 7 publications

(5 citation statements)

References 4 publications

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“…The performance of the 3D-printed samples is compared in Table I with other G-band filters made by different technologies such as deep reactive-ion etching (DRIE) [25]- [26], substrate integrated waveguide (SIW) [27] and computer numerical control (CNC) milling [24], [28]. The advantage of the MLS devices over other filters is a monolithic structure.…”

Section: Filter Measurementmentioning

confidence: 99%

“…The sample was then sectioned using electrical discharge machining (EDM) to allow further characterization on the surface roughness of the inner surfaces, the internal dimensions and the gold coating quality. The measured mm-wave performance of the gold-coated 3D-printed samples is compared below with that of G-band filters manufactured by other technologies [24]- [28]. Additionally, the loss of a straight G-band waveguide section made by MLS was evaluated to extract the effective electrical conductivity.…”

mentioning

confidence: 99%

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Evaluation of 3-D Printed Monolithic G-Band Waveguide Components

Skaik

Salek

Hunyor

et al. 2023

IEEE Trans. Compon., Packag. Manufact. Technol.

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Section: Filter Measurementmentioning

confidence: 99%

mentioning

confidence: 99%

Evaluation of 3-D Printed Monolithic G-Band Waveguide Components

Skaik

Salek

Hunyor

et al. 2023

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Computer numerical controlled (CNC) milling is the most used manufacturing technique for waveguide components [7]- [8]. High precision CNC, with a dimensional tolerance at the level of ± 5 m, is required for D-band devices.…”

mentioning

confidence: 99%

“…Although good performance of waveguide filters has been demonstrated at spot frequencies from 100 GHz to 750 GHz [10]- [16], CNC machining of diplexers is not easy for such high-frequency applications. A CNC-milled G-band, 170-260 GHz, diplexer was realized with an insertion loss of 1.5 dB but a center frequency shift of 3 GHz and bandwidth increase of 30% [7]. A CNC machined hybrid-coupled wideband triplexer at 400 GHz was reported with an insertion loss of 1.75 -2.63 dB [16].…”

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confidence: 99%

D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering

Wang

Skaik

et al. 2022

IEEE Trans. Compon., Packag. Manufact. Technol.

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We report a D-band waveguide diplexer, with two passbands of 130 -134 GHz and 151.5 -155.5 GHz, fabricated using micro laser sintering (MLS) additive manufacturing with stainless-steel. This is the first demonstration of metal 3D printing technology for multi-port filtering device at a sub-THz frequency. For comparison, the same diplexer design has also been implemented using computer numerical controlled (CNC) milling. The diplexer, designed using coupling matrix theory, employs an all-resonator and E-plane split-block structure. The two channels are folded for compactness. A staircase coupled structure is used in one channel to increase the isolation performance. The printed waveguide flanges are modified to adapt to the limited printing volume from the MLS. Effects of fabrication tolerance on the diplexer are investigated. An effective and unconventional electroless plating process is developed. The measured average insertion losses of the gold coated diplexer are 1.31 dB and 1.37 dB respectively. Respective frequency shifts from design values are 0.92% and 1.1%, and bandwidth variations are 4% and 15%. From a comprehensive treatment of the end-to-end manufacture process, the work demonstrates MLS to be a promising fabrication technique for complex waveguide devices at sub-THz frequency range.

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“…A milled 275-500-GHz ultrawideband frequency splitter based on two couplers and individual highand low-pass filters had an IL of 1.5-3.8 dB [13] and an adjacent channel rejection of 35 dB, requiring feature sizes for which 30-μm-diameter milling tools had to be used. A CNC-milled G-band (170-260 GHz) diplexer reported with an IL of only 1.5 dB, but the center frequencies of its passbands shifted downward by 3 GHz and the bandwidths expanded by 30% due to fabrication errors [14]. A comparison of previous diplexer works is summarized in Table I.…”

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confidence: 99%

Silicon Micromachined D-Band Diplexer Using Releasable Filling Structure Technique

Zhao

Glubokov

Campion

et al. 2020

IEEE Trans. Microwave Theory Techn.

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A D-band waveguide diplexer, implemented by silicon micromachining using releasable filling structure (RFS) technique to obtain high-precision geometries, is presented here for the first time. Prototype devices using this RFS technique are compared with devices using the conventional microfabrication process. The RFS technique allows etching large waveguide structures with nearly 90 • sidewall angles for the 400-µm-tall waveguides. The diplexer consists of two direct-coupled cavity six-pole bandpass filters, with the lower and the upper band at 130-134 and 141-148.5 GHz, respectively. The measured insertion loss of the two bands is 1.2 and 0.8 dB, respectively, and the measured return loss is 20 and 18 dB, respectively, across 85% of the passbands. The worst case adjacent channel rejection is better than 59 dB. The unloaded quality factors of a single cavity resonator are estimated from the measurements to reach 1400. Furthermore, for the RFS-based micromachined diplexer, an excellent agreement between measured and simulated data was observed, with a center frequency shift of only 0.8% and a bandwidth deviation of only 8%. In contrast to that, for the conventionally micromachined diplexer of this high complexity, the filter poles are not well controllable, resulting in a large center frequency shift of 3.5%, a huge bandwidth expanding of over 60%, a poor return loss of 6 and 10 dB for the lower and the upper band, respectively, and an adjacent channel rejection of only 22 dB.

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G-Band Diplexer Based on E-Plane Waveguide Structures

Cited by 7 publications

References 4 publications

Evaluation of 3-D Printed Monolithic G-Band Waveguide Components

Evaluation of 3-D Printed Monolithic G-Band Waveguide Components

D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering

Silicon Micromachined D-Band Diplexer Using Releasable Filling Structure Technique

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