Future trends of 3D silicon sensors

Viá, C. Da; Boscardin, M.; Betta, G.-F. Dalla; Haughton, I.; Grenier, P.; Grinstein, S.; Hansen, Thor-Erik; Hasi, J.; Kenney, C.; Kok, Angela; Parker, S. I.; Pellegrini, G.; Povoli, Marco; Tzhnevyi, Vladislav; Watts, S.

doi:10.1016/j.nima.2013.05.048

Cited by 7 publications

(6 citation statements)

References 15 publications

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“…The so called "3D" concept has been developed and experimented in silicon detectors [1,2], for which this solution allows also the employment of correspondingly lower depleting voltages, due to the decreased distance between the polarizing electrodes.…”

Section: Introductionmentioning

confidence: 99%

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confidence: 99%

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Pulsed laser fabrication of 3D diamond sensors

Lagomarsino¹

2015

Proceedings of 11th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors — Po

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3D detectors, whose electrodes extend perpendicularly to the sensor surface, represent one of the solution proposed for the challenges of radiation-harsh environments in high energy physics [1][2][3][4]. We report on the fabrication and characterization of prototypes of 3D diamond detector, which add to the 3D architecture the advantages of diamond as a sensor for tracking purposes. Two different laser sources, a Nd:YAG 1064 Q-switched laser with 8 ns pulse-width and a Ti:sapphire laser source with 30 fs pulse duration have been used to fabricate arrays of graphitic columns in the bulk of a polycrystalline and a single crystal diamond sample. The columns are staggered and connected to graphitic combs which have been fabricated as well by laser irradiation and used as electric contacts. On each sample, an identical pattern of graphitic combs without columns (2D structure) has also been fabricated as a reference. The charge collection efficiency of each 3D sensor has been measured at different voltages and compared with the corresponding 2D structures. The much lower saturation voltages of the 3D sensors compared to those of the planar ones confirm that charge collection takes place at the columnar electrodes. Moreover, an efficiency of 100% is assured by the sensors fabricated with the fslaser source, while a loss in efficiency up to 30% is observed with the sensors fabricated with the ns-laser. The expected behaviour of 3D diamond sensors after strong radiation damage is discussed.

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Section: Introductionmentioning

confidence: 99%

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mentioning

confidence: 99%

Pulsed laser fabrication of 3D diamond sensors

Lagomarsino¹

2015

Proceedings of 11th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors — Po

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“…To achieve saturated drift in a thicker sensor will also require a large bias voltage above 10 kV, potentially causing other problems for steady operation. Columnar or 3D deeply entrenched electrode configuration [28], replacing the existing planar electrode configuration, has recently shown promising results [29,30]. It may also be possible that distributed charge collection may be able to separate photoelectrically absorbed and Compton scattered X-rays.…”

Section: Spc Mode: Physics and Performance Considerationsmentioning

confidence: 99%

“…For Ge, about 17 sensor layers with a thickness around 60 µm each. An alternative to the multilayer 3D detector architecture could be a single thick layer with deeply buried electrodes as mentioned above [28][29][30]. The distances in-between the closest positive and negative electrodes would be less than 200 µm in GaAs, and less than 60 µm in Ge.…”

Section: The Weak Spc Modementioning

confidence: 99%

On the Single-Photon-Counting (SPC) modes of imaging using an XFEL source

Wang¹

2015

J. Inst.

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The requirements to achieve high detection efficiency (above 50%) and gigahertz (GHz) frame rate for the proposed 42-keV X-ray free-electron laser (XFEL) at Los Alamos are summarized. Direct detection scenarios using C (diamond), Si, Ge and GaAs semiconductor sensors are analyzed. Single-photon counting (SPC) mode and weak SPC mode using Si can potentially meet the efficiency and frame rate requirements and be useful to both photoelectric absorption and Compton physics as the photon energy increases. Multilayer three-dimensional (3D) detector architecture, as a possible means to realize SPC modes, is compared with the widely used twodimensional (2D) hybrid planar electrode structure and 3D deeply entrenched electrode architecture. Demonstration of thin film cameras less than 100-µm thick with onboard thin ASICs could be an initial step to realize multilayer 3D detectors and SPC modes for XFELs.

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“…Standard planar devices realized with n-in-p technology show a manageable loss in charge collection efficiency ("only" a factor 5 at the highest fluences) and provide a viable solution, also because of the higher collection speed of electrons compared to holes [11]. Alternative, very attractive, solutions are explored by abandoning the planar paradigm with 3D silicon sensors, where through-silicon doped columns provide lateral collection electrodes that improve both speed and efficiency in charge collection, resulting in an increased radiation tolerance [12].…”

Section: Pos(eps-hep 2013)147mentioning

confidence: 99%

Detector R&D

Forti¹

2014

Proceedings of the European Physical Society Conference on High Energy Physics — PoS(EPS-HEP 2013)

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Detectors are they eyes with which we observe the physics and explore new phenomena. The development of more performing detectors is essential for future physics discoveries and requires appropriate attention, funding, and recognition. In this paper the current trends in High Energy Physics detector research and development are reviewed. Since the topic is broader than the available space, figures are not included in the paper, but can be found in the references, whose main sources are the recent instrumentation conferences [1 -6].

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Future trends of 3D silicon sensors

Cited by 7 publications

References 15 publications

Pulsed laser fabrication of 3D diamond sensors

Pulsed laser fabrication of 3D diamond sensors

On the Single-Photon-Counting (SPC) modes of imaging using an XFEL source

Detector R&D

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