2002
DOI: 10.1080/10408430208500495
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Future Direction for a Diffusion Barrier in Future High-Density Volatile and Nonvolatile Memory Devices

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Cited by 26 publications
(10 citation statements)
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“…The increase in the coloration efficiency by adding of TiO 2 nano-rods suggested that TiO 2 may involve in the redox process of the polymer. The conduction band edge (À4.3 eV) 43 of TiO 2 lies between the HOMO (À5.03 eV) and LUMO (À3.26 eV) levels of PDOCPDT. 27 It was known that when the redox potential of the electroactive chromophore lies above the conduction band edge of the TiO 2 .…”
Section: The Function Of the Tio 2 Nano-rods In The Tio 2 /Pdocpdt Namentioning
confidence: 99%
“…The increase in the coloration efficiency by adding of TiO 2 nano-rods suggested that TiO 2 may involve in the redox process of the polymer. The conduction band edge (À4.3 eV) 43 of TiO 2 lies between the HOMO (À5.03 eV) and LUMO (À3.26 eV) levels of PDOCPDT. 27 It was known that when the redox potential of the electroactive chromophore lies above the conduction band edge of the TiO 2 .…”
Section: The Function Of the Tio 2 Nano-rods In The Tio 2 /Pdocpdt Namentioning
confidence: 99%
“…[1] Its nonvolatile oxide, RuO 2 , is conductive, which is particularly attractive for preparations and applications in oxygen-containing environments. In addition, Ru appears to be a promising Cu diffusion barrier material for future very large-scale integrated circuits for which Cu is used as interconnects.…”
Section: Introductionmentioning
confidence: 99%
“…Fabrication of the new generation storage nodes with three-dimensional structures requires conformal films, [4,5] thus making CVD and ALD [6,7] the most promising techniques for ruthenium deposition for the memory applications. Recently, ruthenium has also been studied as a barrier and seed layer for copper electrodeposition, and ALD is proposed to be the most suitable method for deposition of the ruthenium barriers into the high aspect ratio interconnects.…”
Section: Introductionmentioning
confidence: 99%