Micro‐Manufacturing 2011
DOI: 10.1002/9781118010570.ch1
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Fundamentals of Micro‐Manufacturing

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Cited by 12 publications
(8 citation statements)
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“…If reducing the sample size further to a grain size level, an increase of flow stress can be observed. That is because that at the grain size level each grain in the deformation zone participates into deformation while if specimen size is larger than grain size, grains in the deformation zone present selective deformation which lowers deformation resistance [16]. However, protective passivation oxidation layer generally has much higher deformation resistance than that of inner grains.…”
Section: Macro Hydroformingmentioning
confidence: 95%
“…If reducing the sample size further to a grain size level, an increase of flow stress can be observed. That is because that at the grain size level each grain in the deformation zone participates into deformation while if specimen size is larger than grain size, grains in the deformation zone present selective deformation which lowers deformation resistance [16]. However, protective passivation oxidation layer generally has much higher deformation resistance than that of inner grains.…”
Section: Macro Hydroformingmentioning
confidence: 95%
“…It starts from small scale integrated (SSI) circuit to very large scale integrated (VLSI) circuit and then integration with microelectromechanical system (MEMS). Standard steps to fabricate MEMS like using microelectronic manufacturing methods such as photolithography, etching and deposition [1][2][3][4][5]. Further study should be carried out for looking alternative technique to produce 3 dimension (3D) micro-components with less cost, better durability, better surface roughness and better strength [6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Other processing methods like electrochemical deposition and photolithography are also being investigated for ceramic micro features. However, these methods are not easy to implement, involve chemical handling, and are associated with long processing times [3,4].…”
Section: Introductionmentioning
confidence: 99%