Fundamental study of an electrostatic chuck for silicon wafer handling

Asano, K.; Hatakeyama, F.; Yatsuzuka, K.

doi:10.1109/tia.2002.1003438

Cited by 98 publications

(57 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This includes experimental studies [15,16] and the development of mathematical models of the electrostatic force [17][18][19]. The authors' previous work [20] examined a wider design space using a finite-element analysis optimization tool in order to determine the optimal electrode geometry (see figures 2 and 3 authors found that a concentric circle pattern generated the highest electric field strength.…”

Section: Electrostatic Adhesivesmentioning

confidence: 99%

Improving controllable adhesion on both rough and smooth surfaces with a hybrid electrostatic/gecko-like adhesive

Ruffatto

Parness

Spenko

2014

J. R. Soc. Interface.

119

View full text Add to dashboard Cite

This paper describes a novel, controllable adhesive that combines the benefits of electrostatic adhesives with gecko-like directional dry adhesives. When working in combination, the two technologies create a positive feedback cycle whose adhesion, depending on the surface type, is often greater than the sum of its parts. The directional dry adhesive brings the electrostatic adhesive closer to the surface, increasing its effect. Similarly, the electrostatic adhesion helps engage more of the directional dry adhesive fibrillar structures, particularly on rough surfaces. This paper presents the new hybrid adhesive's manufacturing process and compares its performance to three other adhesive technologies manufactured using a similar process: reinforced PDMS, electrostatic and directional dry adhesion. Tests were performed on a set of ceramic tiles with varying roughness to quantify its effect on shear adhesive force. The relative effectiveness of the hybrid adhesive increases as the surface roughness is increased. Experimental data are also presented for different substrate materials to demonstrate the enhanced performance achieved with the hybrid adhesive. Results show that the hybrid adhesive provides up to 5.1Â greater adhesion than the electrostatic adhesive or directional dry adhesive technologies alone.

show abstract

Section: Electrostatic Adhesivesmentioning

confidence: 99%

Improving controllable adhesion on both rough and smooth surfaces with a hybrid electrostatic/gecko-like adhesive

Ruffatto

Parness

Spenko

2014

J. R. Soc. Interface.

119

View full text Add to dashboard Cite

show abstract

“…Electroadhesion has been used in wafer handling [32] , wall climbing robots [33,34] , rigid and flexible grippers [35,36] . Early development also showed an end effector composed of a rigid flat substrate and an ER fluid encapsulated membrane [17] .…”

mentioning

confidence: 99%

“…Reversibility of the gecko adhesion is also challenging to achieve with lightweight objects, and the adhesion mechanism works poorly on low surface-energy materials, such as Teflon [42] . Electroadhesion can be used with smooth and rough surfaces, with dielectric objects and with metallic objects [32,35] and is fully electrically controlled, obviating the need for additional actuators to pick up or release an object. A potential drawback is a small residual adhesion force after removing the voltage.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Versatile Soft Grippers with Intrinsic Electroadhesion Based on Multifunctional Polymer Actuators

et al. 2015

View full text Add to dashboard Cite

“…10,11 The experiment results, especially the results from the recent work by Koh et al, 12 however, have consistently demonstrated the inappropriateness of this pure quadratic relationship. [12][13][14][15] Also, there is a lack of a standardised or recognised experiment setup and procedure to investigate this relationship, especially by taking the surface texture of the interfacial surfaces and environmental factors into consideration. 9 This is because the interfacial electroadhesive forces can be greatly influenced by surface scratches 9 and changing environmental factors such as humidity and temperature.…”

mentioning

confidence: 99%

Experimental study of relationship between interfacial electroadhesive force and applied voltage for different substrate materials

Guo

Bamber

Petzing

et al. 2017

Applied Physics Letters

View full text Add to dashboard Cite

An experimental investigation into the relationship between the interfacial electroadhesive force and applied voltage up to 20 kV has been presented. Normal electroadhesive forces have been obtained between a double-electrode electroadhesive pad and three optically flat and different substrate materials: glass, acrylic, and polycarbonate. The results have shown that not all substrate materials are good for the generation of electroadhesive forces. Only 15.7 Pa has been obtained between the pad and the polycarbonate substrate under 20 kV, whereas 46.3 Pa and 123.4 Pa have been obtained on the acrylic and glass substrate, respectively. Based on the experimental data, empirical models, with an adjusted R-square value above 0.995 in all cases, have been obtained for the three substrates. However, it has not been possible to develop a general empirical model which is suitable for all substrates. This further indicates the need for a large quantity of experimental data to obtain robust empirical models for different substrate materials in order to reliably use electroadhesive technologies for material handling applications.

show abstract

Fundamental study of an electrostatic chuck for silicon wafer handling

Cited by 98 publications

References 2 publications

Improving controllable adhesion on both rough and smooth surfaces with a hybrid electrostatic/gecko-like adhesive

Improving controllable adhesion on both rough and smooth surfaces with a hybrid electrostatic/gecko-like adhesive

Versatile Soft Grippers with Intrinsic Electroadhesion Based on Multifunctional Polymer Actuators

Experimental study of relationship between interfacial electroadhesive force and applied voltage for different substrate materials

Contact Info

Product

Resources

About