Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

Yan, Jiwang; Asami, Tooru; Harada, Hirofumi; Kuriyagawa, Tsunemoto

doi:10.1016/j.precisioneng.2008.10.008

Cited by 223 publications

(86 citation statements)

References 31 publications

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“…Figure 13a shows the simulation results which were obtained by post-processing of the MD trajectories using the dislocation extraction algorithm (DXA). It was anticipated that dislocation nucleation might occur during the process of nanometric cutting [41], but no dislocations were found to travel ahead of the tool that will drive plasticity in silicon (this is possible due to scale limitations of the MD) since experimental studies reported presence of several type of dislocations in contrast to what is observed here [51,52]. Careful examination of the simulation video showed some ¼<111> partial dislocations in the sub-surface and not in the cutting zone.…”

Section: Structural Transformations and Mechanism Of Ductility In Silmentioning

confidence: 92%

Influence of microstructure on the cutting behaviour of silicon

et al. 2016

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General rights Copyright for the publications made accessible via the Queen's University Belfast Research Portal is retained by the author(s) and / or other copyright owners and it is a condition of accessing these publications that users recognise and abide by the legal requirements associated with these rights. Abstract:We use molecular dynamics simulation to study the mechanisms of plasticity during cutting of monocrystalline and polycrystalline silicon. Three scenarios are considered: (i) cutting a single crystal silicon workpiece with a single crystal diamond tool, (ii) cutting a polysilicon workpiece with a single crystal diamond tool, and (iii) cutting a single crystal silicon workpiece with a polycrystalline diamond tool. A long-range analytical bond order potential is used in the simulations, providing a more accurate picture of the atomic-scale mechanisms of brittle fracture, ductile plasticity, and structural changes in silicon. The MD simulation results show a unique phenomenon of brittle cracking typically inclined at an angle of 45° to 55° to the cut surface, leading to the formation of periodic arrays of nanogrooves in monocrystalline silicon, which is a new insight into previously published results. Furthermore, during cutting, silicon is found to undergo solid-state directional amorphisation without prior Si-I to Si-II (beta tin) transformation, which is in direct contrast to many previously published MD studies on this topic. Our simulations also predict that the propensity for amorphisation is significantly higher in single crystal silicon than in polysilicon, signifying that grain boundaries eases the material removal process.

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Section: Structural Transformations and Mechanism Of Ductility In Silmentioning

confidence: 92%

Influence of microstructure on the cutting behaviour of silicon

et al. 2016

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“…In diamond cutting of single crystalline silicon, there is a machininginduced subsurface damage exhibiting four features of amorphization, poly-crystallization, dislocation, and internal microcracking [52,53]. Near crack free-surface is transformed into an amorphous phase above a dislocation layer, which is mainly caused by the high compressive stress in the cutting zone [52].…”

Section: Subsurface Damagementioning

confidence: 99%

A review on ductile mode cutting of brittle materials

2018

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Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

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“…7a the saffron yellow curve, which suggest the deformation degree in silicon is related to the depth of cut. This phenomenon is presumably aroused by the non-uniform distribution of stress which offered by the plastic deformation of dislocations [33,34]. Under the effect of the anisotropic stress of Si threefold degeneracy phonon modes at Brillouin zone q = 0 was broken, resulting in the split of different phonon frequencies.…”

Section: Raman Spectroscopy Analysis Of Rb-sicmentioning

confidence: 99%

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

Zhang

et al. 2017

Int J Adv Manuf Technol

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Surface and subsurface damages appear inevitably in the grinding process, which will influence the performance and lifetime of the machined components. In this paper, ultraprecision grinding experiments were performed on reactionbonded silicon carbide (RB-SiC) ceramics to investigate surface and subsurface damages characteristics and formation mechanisms in atomic scale. The surface and subsurface damages were measured by a combination of scanning electron microscopy (SEM), atomic force microscopy (AFM), raman spectroscopy, and transmission electron microscope (TEM) techniques. Ductile-regime removal mode is achieved below critical cutting depth, exhibiting with obvious plow stripes and pile-up. The brittle fracture behavior is noticeably influenced by the microstructures of RB-SiC such as impurities, phase boundary, and grain boundary. It was found that subsurface damages in plastic zone mainly consist of stacking faults (SFs), twins, and limited dislocations. No amorphous structure can be observed in both 6H-SiC and Si particles in RB-SiC ceramics. Additionally, with the aid of high-resolution TEM analysis, SFs and twins were found within the 6H-SiC closed packed plane, i.e., (0001). At last, based on the SiC structure characteristic, the formation mechanisms of SFs and twins were discussed, and a schematic model was proposed to clarify the relationship between plastic deformation-induced defects and brittle fractures.

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Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

Cited by 223 publications

References 31 publications

Influence of microstructure on the cutting behaviour of silicon

Influence of microstructure on the cutting behaviour of silicon

A review on ductile mode cutting of brittle materials

Experimental investigation on the surface and subsurface damages characteristics and formation mechanisms in ultra-precision grinding of SiC

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