Fundamental insight on developing low dielectric constant polyimides

Simpson, Joycelyn O.; Clair, Anne K. St.

doi:10.1016/s0040-6090(97)00481-1

Cited by 201 publications

(180 citation statements)

References 9 publications

(9 reference statements)

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“…[21] The presence of free volume in the form of pores will similarly result in a decrease in dielectric constant as it being occupied by air whose relative permittivity is about one. A higher fractional free volume means that the density of the material will be lower resulting in a lower polarisible group per unit volume.…”

Section: Mechanism Of Interaction With Electric Fieldmentioning

confidence: 99%

Polymer Dielectric Materials

Ahmad¹

2012

Dielectric Material

156

144

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Section: Mechanism Of Interaction With Electric Fieldmentioning

confidence: 99%

Polymer Dielectric Materials

Ahmad¹

2012

Dielectric Material

156

144

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“…Among various polymer dielectrics, polyimides (PIs) have been investigated more extensively as high performance interlayer dielectrics (ILDs) than most other polymers due to their desirable high-temperature stability, excellent mechanical and dielectric properties for ULSI fabrications [4][5][6]. However, conventional PI dielectrics usually have k values around 3.0, which cannot meet the rapid development of ULSI assembly.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterization of flexible and high-temperature resistant polyimide aerogel with ultra-low dielectric constant

Zhang¹,

Liu²,

Shen³

2016

Express Polym. Lett.

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Abstract.A polyimide (PI) aerogel with excellent combined thermal and dielectric properties was successfully prepared by the polycondensation of 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 5-amino-2-(4-aminophenyl)benzoxazole (APBO) and octa(amino-phenyl)silsesquioxane (OAPS) crosslinker, followed by a supercritical carbon dioxide (scCO 2 ) drying treatment. The developed PI aerogel exhibited an ultra-low dielectric constant (k) of 1.15 at a frequency of 2.75 GHz, a volume resistivity of 5.45·1014 Ω·cm, and a dielectric strength of 132 kV/cm. The flexible PI aerogel exhibited an openpore microstructure consisting of three-dimensional network with tangled nanofibers morphology with a porosity of 85.6% (volume ratio), an average pore diameter of 19.2 nm, and a Brunauer-Emmet-Teller (BET) surface area of 428.6 m 2 /g. In addition, the PI aerogel showed excellent thermal stability with a glass transition temperature (T g ) of 358.3°C, a 5% weight loss temperature over 500°C, and a residual weight ratio of 66.7% at 750°C in nitrogen.

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“…Aromatic polyimide ͑PI͒ has been widely used as an interlayer dielectric in microelectronic devices, thanks to its good mechanical properties, excellent chemical and thermal stabilities, high breakdown voltage, and low dielectric constant. [1][2][3][4][5][6][7][8] Simpson and St. Clair 3 have summarized the strategies used to lower dielectric constant in polyimides. In particular, fluorine is usually introduced into polyimide in order to further decrease the dielectric constant.…”

mentioning

confidence: 99%

“…[1][2][3][4][5][6] In electronic packaging, low-k dielectric materials minimize cross talk and maximize signal propagation speed in devices. Aromatic polyimide ͑PI͒ has been widely used as an interlayer dielectric in microelectronic devices, thanks to its good mechanical properties, excellent chemical and thermal stabilities, high breakdown voltage, and low dielectric constant.…”

mentioning

confidence: 99%

Dielectric relaxation in polyimide nanofoamed films with low dielectric constant

Zhang

Huang

et al. 2008

Applied Physics Letters

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Polyimide nanofoamed films have been prepared from the polyimide precursors ͑PMDA-ODA͒ and poly͑ethylene oxide͒ ͑PEO͒ in N , N-dimethylacetamide. The dielectric properties of the films were studied over the temperature range of −150-150°C and a frequency range of 1 Hz-10 MHz. The frequency dependence of the dielectric constant for nanofoamed films with different amounts of PEO was studied. An relaxation process at below the glass transition temperature of the polyimide nanofoamed films was found. The peak value of the dielectric loss increased with increasing amount of PEO. © 2008 American Institute of Physics. ͓DOI: 10.1063/1.2840715͔In recent years, great attention has been paid to the lowk polymer and its composites as the next-generation interlayer dielectrics for multilayer interconnection in microelectronics. [1][2][3][4][5][6] In electronic packaging, low-k dielectric materials minimize cross talk and maximize signal propagation speed in devices. Aromatic polyimide ͑PI͒ has been widely used as an interlayer dielectric in microelectronic devices, thanks to its good mechanical properties, excellent chemical and thermal stabilities, high breakdown voltage, and low dielectric constant. [1][2][3][4][5][6][7][8] Simpson and St. Clair 3 have summarized the strategies used to lower dielectric constant in polyimides. In particular, fluorine is usually introduced into polyimide in order to further decrease the dielectric constant. 9 Furthermore, a high degree of free volume will offer as a low dielectric constant phase. In our recent study, silica tubes/PI composite films were investigated and the dielectric constant could be reduced to 2.9. 4 Moreover, a series of porous polyimide materials such as polyimide nanofoamed films prepared from PI and poly͑ethylene oxide͒ ͑PEO͒ have been explored. 10 One of the most suitable physical methods for the investigation of molecular mobility in low-k polymer samples under ac electrical field is the dielectric spectroscopy. This method makes it possible to obtain data on the molecular mobility of a macromolecule as a whole and of its mainchain segments, bulky side groups, etc. Dielectric losses in a polymer sample appear during thermal orientation of polar kinetic units. Although it has been reported that most of aromatic polyimide and copolyimide films exhibit relaxational processes ͑␣, ␤, and ␥ relaxation͒ in their dynamic mechanical and dielectric behaviors, 11,12 there is limited relaxation studies on polyimides. In this letter, PI-PEO nanofoamed films were prepared via in situ polymerization and thermal treatment. A low dielectric constant was achieved. The dielectric properties of these nanofoamed films over broad temperature and frequency ranges were studied and the dielectric relaxation was discussed in details.Pyromellitic dianhydride ͑PMDA͒ ͑Hangzhou Taida Ltd.͒ and oxydimethylaniline ͑ODA͒ ͑Beijing Chemical Reagent Ltd. China͒ were dehydrated prior to use. N , NDimethylacetamide ͑Beijing Yili Chemicals Reagent Co.͒ was used as received. PEO ͑Beijing Guoren Yikang Ltd...

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Fundamental insight on developing low dielectric constant polyimides

Cited by 201 publications

References 9 publications

Polymer Dielectric Materials

Polymer Dielectric Materials

Synthesis and characterization of flexible and high-temperature resistant polyimide aerogel with ultra-low dielectric constant

Dielectric relaxation in polyimide nanofoamed films with low dielectric constant

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