Functionalized Poly(phenylene ether) with high thermal stability as flexible dielectrics and substrates for organic field-effect transistors

Chen, Chun-Kai; Lin, Yan‐Cheng; Ercan, Ender; Yu, Ping‐Jui; Ho, Ja‐an Annie; Ueda, Mitsuru; Chen, Wen‐Chang

doi:10.1016/j.orgel.2021.106225

Cited by 4 publications

(2 citation statements)

References 34 publications

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“…[32] The FOFETs devices constructed by transfer printing technique via π-conjugated polymers of isoindigo-bithiophene (II2T) as channel materials have good dielectric properties with a hole mobility of 0.45 cm 2 V −1 s −1 . [33,34] New copolymer semiconductors have also demonstrated excellent hole transport performances in FOFET applications. [35] Choi et al designed and synthesized a series of asymmetric monomer alternatively conjugated copolymers-PDPP-TVS to process FOFET devices with green solvents without chlorine atoms, and measured the mobility of this material up to 8.2 cm 2 V −1 s −1 .…”

Section: P-type Materialsmentioning

confidence: 99%

Flexible Electronics Based on Organic Semiconductors: from Patterned Assembly to Integrated Applications

Liu

Yang

et al. 2023

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Organic flexible electronic devices are at the forefront of the electronics as they possess the potential to bring about a major lifestyle revolution owing to outstanding properties of organic semiconductors, including solution processability, lightweight and flexibility. For the integration of organic flexible electronics, the precise patterning and ordered assembly of organic semiconductors have attracted wide attention and gained rapid developments, which not only reduces the charge crosstalk between adjacent devices, but also enhances device uniformity and reproducibility. This review focuses on recent advances in the design, patterned assembly of organic semiconductors, and flexible electronic devices, especially for flexible organic field‐effect transistors (FOFETs) and their multifunctional applications. First, typical organic semiconductor materials and material design methods are introduced. Based on these organic materials with not only superior mechanical properties but also high carrier mobility, patterned assembly strategies on flexible substrates, including one‐step and two‐step approaches are discussed. Advanced applications of flexible electronic devices based on organic semiconductor patterns are then highlighted. Finally, future challenges and possible directions in the field to motivate the development of the next generation of flexible electronics are proposed.

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Section: P-type Materialsmentioning

confidence: 99%

Flexible Electronics Based on Organic Semiconductors: from Patterned Assembly to Integrated Applications

Liu

Yang

et al. 2023

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“…The rapid technological developments in the era of Internet of Things, sensor networks, robotics, and artificial intelligence bring new challenges to develop material systems and architectures for memory technologies with large storage capacity. − Despite intensive progress in this field, conventional voltage-driven memory lags far behind the increasing demands for high data storage density, fast transmission, and physical miniaturization designs. The state-of-the-art nonvolatile photomemory, which transduce broadband optical stimuli into electrical signals, thereby reducing the dependence on electrical programming, have emerged as a potential candidate in ultrafast, multibit data storage, and noncontact programming memory. − Material systems including inorganic materials, organic–inorganic hybrid composites, conjugated-insulated polymer blends, and block-copolymers (BCPs) have been proposed for nonvolatile photomemory in recent years. − However, the photoresponsivity and memory retention of memory comprising inorganic and composite systems strongly rely on the size control and distribution of trapping units in a nanoscale, which produce cumbersome device fabrication. − …”

Section: Introductionmentioning

confidence: 99%

Multistimuli-Responsive Plasticity Transitions of a Phototransistor Conferred by Using Thermoresponsive Polyfluorene Block Copolymers

Ercan

Hsu

Lin

et al. 2022

ACS Appl. Polym. Mater.

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Photonic transistor memory has drawn extensive research attention owing to its noncontact programming capability, rapid data transmission, and low power consumption. In this research, a series of thermoresponsive poly(fluorene)-block-poly(Nisopropylacrylamide) (PF-b-PNIPAAm) with varied compositions were employed as an electret layer for photomemory application. Accordingly, the device presented ambipolar charge trapping with a decent memory ratio of ∼10 5 and a large memory window of ∼30 V by applying electrical and photoprogramming. More importantly, the photomemory exhibited a higher data retention stability at 40 °C, which was attributed to the conformational reorganization of PF-b-PNIPAAm at a temperature over its lower critical solution temperature. Finally, the phototransistor was modulated as a photosynapse to emulate fundamental functions, including the short-term and long-term plasticity. This research opens up possibilities in polymer-based memory under photo-/thermal-operations to realize human-like optical processing for neuromorphic computing systems.

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Synthesis of phenolphthalein/bisphenol A‐based poly(arylene ether nitrile) copolymers: Preparation and properties of films

Zhang

Liu

2022

J of Applied Polymer Sci

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Poly(arylene ether nitrile) (PEN) is a class of high‐performance engineering plastics of poly(arylene ether) with cyano groups as side groups, which can get improved thermal, mechanical, and electrical properties through simple molecular structure design. In this work, a series of PEN (BPA/PP based PEN) copolymers were synthesized with varying amounts of phenolphthalein and bisphenol A. The influence of the copolymer molecular structure variations on the thermal, mechanical, and dielectric properties of PEN copolymer films was investigated. The results demonstrated that the BPA/PP based PEN copolymer films have great mechanical properties and low dielectric constant, as well as enhanced thermal properties. The highest 5% weight loss temperature of 494.9°C was obtained by PEN‐B7P3, while the highest glass transition temperature of 238.6°C was obtained by PEN‐B3P7. Porous BPA/PP based PEN films prepared by non‐solvent induced phase separation (NIPS) exhibited satisfactory mechanical properties and the highest tensile strength of 9.4 MPa was achieved. Moreover, the introduction of the phenolphthalein structure into the PEN molecular chain can improve the heat resistance of the PEN copolymers without deteriorating the dielectric properties, which gives the copolymers great potential as candidates for applications in flexible electronics and wireless communication.

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Functionalized Poly(phenylene ether) with high thermal stability as flexible dielectrics and substrates for organic field-effect transistors

Cited by 4 publications

References 34 publications

Flexible Electronics Based on Organic Semiconductors: from Patterned Assembly to Integrated Applications

Flexible Electronics Based on Organic Semiconductors: from Patterned Assembly to Integrated Applications

Multistimuli-Responsive Plasticity Transitions of a Phototransistor Conferred by Using Thermoresponsive Polyfluorene Block Copolymers

Synthesis of phenolphthalein/bisphenol A‐based poly(arylene ether nitrile) copolymers: Preparation and properties of films

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