“…Other than the latter disadvantages of the electrochemical deposition include possibility of contamination of the target with impurities from the electrolyte bath which are co-deposited or coprecipitated with the deposited metal [74]. Further on, the electrochemically plated deposits may have non-uniform thickness [31,46,74] and when the deposition is carried out from a solution with low metal content, the process can be time consuming (e.g. [2,8,10,13,17,19,45,48,[59][60][61][62][63][64][65][66]).…”