2020
DOI: 10.36227/techrxiv.11768811
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Full-Wave Verification of an Electromagnetic Inversion Metasurface Design Method

Abstract: This paper summarizes, extends, and synthetically evaluates a method for metasurface design which uses electromagnetic inversion. After the inversion algorithm determines a homogenized surface susceptibility model to implement a desired power pattern, the susceptibility distribution is converted to a three-layer admittance sheet topology. Lastly, full-wave commercial software is used to simulate and verify the performance of a metasurface designed and implemented using the proposed procedure.

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Cited by 4 publications
(3 citation statements)
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“…We then simulate the designed metasurface in ANSYS HFSS using the method described in [25]. This technique implements each unit cell using a three-layer admittance sheet topology [26], using the conversion between susceptibilities and admittances explicitly stated in [25]. The unit cells are then modelled in HFSS using three impedance boundary conditions, between which exist two substrate layers.…”
Section: Resultsmentioning
confidence: 99%
“…We then simulate the designed metasurface in ANSYS HFSS using the method described in [25]. This technique implements each unit cell using a three-layer admittance sheet topology [26], using the conversion between susceptibilities and admittances explicitly stated in [25]. The unit cells are then modelled in HFSS using three impedance boundary conditions, between which exist two substrate layers.…”
Section: Resultsmentioning
confidence: 99%
“…In order to simulate the metasurfaces using commercial software, we employ a three-layer admittance sheet topology [23], [35]- [37] for each unit cell as shown in Figure 4. The conversion from the susceptibility profiles to the admittance sheet model is performed using the procedure in [38]. At a given unit cell, we start by rearranging (33) into the ABCD representation of a two-port network as…”
Section: Conversion To the Three-layer Modelmentioning
confidence: 99%
“…However, this is usually not sufficient to complete the metasurface design process. Physically implementing a metasurface directly from its associated GSTC parameter profile is not done in practice, instead, the GSTC parameters are often transformed to microwave circuit parameters such as impedance, admittance, or scattering parameters [7,43,[83][84][85]95] so that the appropriate subwavelength metasurface elements can be designed in a separate step [7,43].…”
Section: Introductionmentioning
confidence: 99%