1992 IEEE Microwave Symposium Digest MTT-S
DOI: 10.1109/mwsym.1992.188191
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Full-wave analysis of 3D metallization structures using a spectral domain technique

Abstract: A full-wave method for the investigation of microstrip-and coplanar-structures including 3d metallization structures is presented. Spectral domain analysis method is used to calculate the Sparameters of unshielded microwave components containing bond-wires and air-bridges. The general formulation and the procedure of the method are described. The application of the theory is given by a comparison of measured and calculated results for a spiral inductor.

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Cited by 4 publications
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